公开(公告)号：US20230197351A1

公开(公告)日：2023-06-22

申请号：US17557572

申请日：2021-12-21

申请人： Chong ZHANG ,  Cheng XU ,  Junnan ZHAO ,  Ying WANG ,  Meizi JIAO

发明人： Chong ZHANG ,  Cheng XU ,  Junnan ZHAO ,  Ying WANG ,  Meizi JIAO

IPC分类号： H01G4/33 ,  H01G4/008 ,  H01G4/12 ,  H01G4/224 ,  H01L49/02 ,  H01L27/01

CPC分类号： H01G4/33 ,  H01G4/008 ,  H01G4/224 ,  H01G4/1209 ,  H01L27/016 ,  H01L28/75

摘要： Embodiments herein relate to systems, apparatuses, or processes directed to packages that include one or more glass cores that have thin film capacitors on one or more sides of the one or more glass cores. The film capacitors may be formed in-situ on the glass cores during substrate manufacturing. Other embodiments may be described and/or claimed.

公开(公告)号：US20200005994A1

公开(公告)日：2020-01-02

申请号：US16020035

申请日：2018-06-27

申请人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

发明人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

IPC分类号： H01F27/32 ,  H01F27/28 ,  H01L23/498 ,  H01F41/04 ,  H01L21/48

摘要： Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.