METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE 审中-公开
    形成半导体器件精细图案的方法

    公开(公告)号:US20110201202A1

    公开(公告)日:2011-08-18

    申请号:US13007071

    申请日:2011-01-14

    IPC分类号: H01L21/3105

    CPC分类号: H01L21/0337 H01L21/0338

    摘要: A method of forming fine patterns of a semiconductor device, the method including providing a patternable layer; forming a plurality of first photoresist layer patterns on the patternable layer; forming an interfacial layer on the patternable layer and the plurality of first photoresist layer patterns; forming a planarization layer on the interfacial layer; forming a plurality of second photoresist layer patterns on the planarization layer; forming a plurality of planarization layer patterns using the plurality of second photoresist layer patterns; and forming a plurality of layer patterns using the plurality of planarization layer patterns and the plurality of first photoresist layer patterns.

    摘要翻译: 一种形成半导体器件的精细图案的方法,所述方法包括提供可图案化层; 在所述可图案层上形成多个第一光致抗蚀剂层图案; 在所述可图案层和所述多个第一光致抗蚀剂层图案上形成界面层; 在界面层上形成平坦化层; 在平坦化层上形成多个第二光致抗蚀剂层图案; 使用所述多个第二光致抗蚀剂层图案形成多个平坦化图案; 以及使用所述多个平坦化层图案和所述多个第一光致抗蚀剂层图案形成多个层图案。