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1.发明授权公开(公告)号：US08172978B2
公开(公告)日：2012-05-08
申请号：US12250090
申请日：2008-10-13
IPC分类号： B29C65/52 , B32B37/02 , B32B37/06 , B32B37/14 , G06Q30/00 , G06K19/063 , B32B37/08 , B32B37/18 , G08B13/14 , B44C1/24
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/48091 , H01L2224/48247 , Y10T156/1039 , Y10T428/24802 , Y10T428/28 , Y10T428/2804 , H01L2924/00014
摘要： The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synthetic paper layer (24) in order to electrically connect said module to said antenna and agglomerate the layers (20, 22 and 24) together.
摘要翻译： 本发明涉及一种用于制造射频识别装置（RFID）的方法，该装置具有连接到天线的天线和芯片（12），该方法包括以下步骤：打印具有触点（17和17）的天线 在由纸或合成纸制成的支撑件（20）上，将粘合介电材料放置在天线的触点之间，将集成电路模块（10）定位在支撑件上，模块具有一组触点（17,18）和 所述芯片（12）连接到所述模块的封装（14）内的接触组，使得所述模块的触点组与所述天线的触点相对，放置热塑性层（22）和纸或合成纸 所述两层（22和24）在所述模块（10）的封装位置（14）处设置有凹部（21,23），将所述三层层叠在一起，所述天线支撑件 层（20），热塑性层（22） 以及纸或合成纸层（24），以将所述模块电连接到所述天线并将层（20,22和24）聚集在一起。
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2.发明授权公开(公告)号：US08038831B2
公开(公告)日：2011-10-18
申请号：US12250404
申请日：2008-10-13
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/48091 , H01L2224/48247 , Y10T156/1039 , Y10T428/24802 , Y10T428/28 , Y10T428/2804 , H01L2924/00014
摘要： A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps: producing an antenna (12) having contacts (13 and 14) on a support (10), creating a recess (20) between the contacts (13 and 14), placing adhesive dielectric material (25, 26) near the contacts of the antenna, positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20), placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60), placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film, laminating all the layers.
摘要翻译： 一种用于制造具有天线的射频识别装置和连接到天线的芯片（12）的射频识别装置的身份小册子盖的方法，所述方法包括以下步骤：产生具有接触（13和14）的天线（12） 支撑件（10），在触头（13和14）之间形成凹部（20），将粘合介电材料（25,26）放置在天线的触点附近，将集成电路模块（19）定位在支撑件上，使得 模块的触点组与天线的触点相对，并且模块的封装在凹部（20）中，放置在具有天线的支撑体的表面上，至少一层热粘膜（40， 50,60），将覆盖层（70）放置在热粘合膜的层（或）层（40或50和60）上，层压所有层。
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3.发明申请公开(公告)号：US20090120564A1
公开(公告)日：2009-05-14
申请号：US12250404
申请日：2008-10-13
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/48091 , H01L2224/48247 , Y10T156/1039 , Y10T428/24802 , Y10T428/28 , Y10T428/2804 , H01L2924/00014
摘要： A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps: producing an antenna (12) having contacts (13 and 14) on a support (10), creating a recess (20) between the contacts (13 and 14), placing adhesive dielectric material (25, 26) near the contacts of the antenna, positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20), placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60), placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film, laminating all the layers.
摘要翻译： 一种用于制造具有天线的射频识别装置和连接到天线的芯片（12）的射频识别装置的身份小册子盖的方法，所述方法包括以下步骤：产生具有接触（13和14）的天线（12） 支撑件（10），在触头（13和14）之间形成凹部（20），将粘合介电材料（25,26）放置在天线的触点附近，将集成电路模块（19）定位在支撑件上，使得 模块的触点组与天线的触点相对，并且模块的封装在凹部（20）中，放置在具有天线的支撑体的表面上，至少一层热粘膜（40， 50,60），将覆盖层（70）放置在热粘合膜的层（或）层（40或50和60）上，层压所有层。
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