公开(公告)号：US20090014527A1

公开(公告)日：2009-01-15

申请号：US12138796

申请日：2008-06-13

申请人： Yannick GRASSET ,  Nicolas Pangaud ,  Christophe Halope

发明人： Yannick GRASSET ,  Nicolas Pangaud ,  Christophe Halope

IPC分类号： G06K19/077 ,  H01L21/58

CPC分类号： H01L23/48 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07756 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention concerns a method for connecting an electronic chip (10) to contacts (47 and 48) of an electric circuit and designed to receive the chip, the chip being provided with two conductive plates (31 and 32) located on the last layer making up the chip and at least one electromagnetic shielding layer, at least one of the plates (31 or 32) being entirely covered with an electrically insulating layer (34), the method including the following steps: Placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), so as to maintain the electronic chip (10) in a fixed position relative to the circuit, Positioning the electronic chip (10) on the circuit so that the conductive plates (31 et 32) are opposite the contacts (47 and 48) of the electric circuit, so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31 or 32), the electrically insulating layer completely covering said plate and the contact (47 or 48).

摘要翻译： 本发明涉及一种用于将电子芯片（10）连接到电路的触点（47和48）并被设计为接收芯片的方法，该芯片设置有位于最后层上的两个导电板（31和32） 所述芯片和至少一个电磁屏蔽层，所述板（31或32）中的至少一个被电绝缘层（34）完全覆盖，所述方法包括以下步骤：将粘合介电材料（40）放置在 （47,48）之间的电路，以便将电子芯片（10）相对于电路保持在固定位置。将电子芯片（10）定位在电路上，使得导电板（31等）32 与电路的触点（47和48）相对，从而在芯片和电路之间形成由导电板（31或32）组成的至少一个电容链路，电绝缘层完全覆盖所述板 和cont 行为（47或48）。

公开(公告)号：US20070001859A1

公开(公告)日：2007-01-04

申请号：US11516753

申请日：2006-09-07

申请人： Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

发明人： Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

IPC分类号： G08B13/14

CPC分类号： B32B37/02 ,  B32B37/04 ,  B32B37/203 ,  B32B2305/342 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2425/00 ,  B32B2519/02 ,  G06K19/07749 ,  Y10T29/49002

摘要： Method of manufacturing a contactless chip card including an antenna support (40) on which the antenna is screenprinted and an electronic module or a chip (50) connected to the two antenna terminals and at least two card bodies on either side of antenna support, the antenna bodies being thermoplastic sheets (62, 64, 66, and 68) applied by hot pressure lamination, the sheet of thermoplastic (62) which is applied onto the face of the antenna support (40) receiving electronic module or chip (50) is perforated with a through-cavity (56) and its thickness is greater than the thickness of electronic module or chip (50), said cavity (56) being situated such that said electronic module or chip (50) is inside the cavity when said sheet (62) is placed on said support (40) before lamination step and such that electronic module or chip (50) is not subjected to any pressure during the lamination step.

摘要翻译： 一种非接触式芯片卡的制造方法，其特征在于，包括：天线支撑体（40），屏幕上贴有天线;以及电子模块或芯片（50），连接到两个天线端子和至少两个卡体，天线支架的任一侧， 天线体是通过热压层压施加的热塑性片材（62,64,66和68），施加到接收电子模块或芯片（50）的天线支撑件（40）的表面上的热塑性塑料片（62）是 穿孔具有通孔（56），并且其厚度大于电子模块或芯片（50）的厚度，所述腔体（56）设置成使得当所述片材（56）位于腔体内时，所述电子模块或芯片 （62）在层压步骤之前放置在所述支撑件（40）上，并且使得电子模块或芯片（50）在层压步骤期间不经受任何压力。

公开(公告)号：US20050275540A1

公开(公告)日：2005-12-15

申请号：US11149144

申请日：2005-06-10

申请人： Christophe Halope ,  Patrick Sure

发明人： Christophe Halope ,  Patrick Sure

IPC分类号： G06K19/073 ,  G06K19/077 ,  G07C9/00 ,  G07D7/00 ,  G08B13/14

CPC分类号： G07C9/00031 ,  B42D25/24 ,  G06K19/025 ,  G06K19/073 ,  G06K19/07749 ,  G07C2209/41

摘要： The invention concerns a radio frequency identification device (RFID) including a chip (12) and an antenna (10) connected together on a support, the antenna being printed onto the support and the support being fixed to an object with an added attachment means. According to the main characteristic, the attachment means overlaps at least once at least one turn of the antenna so that the radio frequency identification device (RFID) is destroyed if the support is detached from the object without the attachment means being removed.

摘要翻译： 本发明涉及一种射频识别装置（RFID），其包括在支撑件上连接在一起的芯片（12）和天线（10），天线被印刷到支撑件上，并且支撑件通过附加的附接装置固定到物体上。 根据主要特征，连接装置至少与天线的至少一圈重叠，使得如果支撑件从物体上拆下而没有附接装置被移除，则射频识别装置（RFID）被破坏。

公开(公告)号：US07710276B2

公开(公告)日：2010-05-04

申请号：US11790902

申请日：2007-04-27

申请人： Christophe Halope ,  Anne Le Paih

发明人： Christophe Halope ,  Anne Le Paih

IPC分类号： G08B13/14 ,  H01L21/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： G06K19/07749

摘要： A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

公开(公告)号：US20090095415A1

公开(公告)日：2009-04-16

申请号：US12250090

申请日：2008-10-13

申请人： Christophe HALOPE ,  Olivier MAZABAUD

发明人： Christophe HALOPE ,  Olivier MAZABAUD

IPC分类号： B32B38/14

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T156/1039 ,  Y10T428/24802 ,  Y10T428/28 ,  Y10T428/2804 ,  H01L2924/00014

摘要： The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps:printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper,placing adhesive dielectric material between the contacts of the antenna,positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna,placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10),laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synthetic paper layer (24) in order to electrically connect said module to said antenna and agglomerate the layers (20, 22 and 24) together.

摘要翻译： 本发明涉及一种用于制造射频识别装置（RFID）的方法，该装置具有连接到天线的天线和芯片（12），该方法包括以下步骤：打印具有触点（17和17）的天线 在由纸或合成纸制成的支撑件（20）上，将粘合介电材料放置在天线的触点之间，将集成电路模块（10）定位在支撑件上，模块具有一组触点（17,18）和 所述芯片（12）连接到所述模块的封装（14）内的接触组，使得所述模块的触点组与所述天线的触点相对，放置热塑性层（22）和纸或合成纸 所述两层（22和24）在所述模块（10）的封装位置（14）处设置有凹部（21,23），将所述三层层叠在一起，所述天线支撑件 层（20），热塑性层（22） 以及纸或合成纸层（24），以将所述模块电连接到所述天线并将层（20,22和24）聚集在一起。

公开(公告)号：US07271039B2

公开(公告)日：2007-09-18

申请号：US11126314

申请日：2005-05-11

申请人： Christophe Halope

发明人： Christophe Halope

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H05K3/207 ,  G06K19/07749 ,  H05K1/0313 ,  H05K1/165 ,  H05K1/185 ,  H05K1/187 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2201/0376

摘要： A method for manufacturing a radiofrequency identification device which includes a manufacturing process for an antenna which includes screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting the support to heat treatment to bake and polymerize the conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination which includes making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, and removal of the transfer paper sheet.

摘要翻译： 一种射频识别装置的制造方法，其特征在于，包括将导电性聚合物墨水丝网印刷到转印纸上的天线的制造方法，然后对载体进行热处理以使导电性油墨进行烘烤和聚合， 将具有触点的芯片14连接到天线12，其包括通过热压成型使得转印纸与通过热压成型的构成天线的支撑的一层塑料材料16一体地形成， 丝网印刷天线和芯片均嵌入塑料材料层内，并移除转印纸。

公开(公告)号：US20070077730A1

公开(公告)日：2007-04-05

申请号：US11529317

申请日：2006-09-29

申请人： Christophe Halope

发明人： Christophe Halope

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/67132 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/75842 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

摘要： The invention concerns a method for extracting chips (20) from a silicon wafer (10) and for transferring each chip on an electronic device including the following steps: Extracting the good chips from the silicon wafer (10) and transferring them on a roll-up adhesive film (28) so that the chips are spaced out by a certain distance, Transferring the chips (20) from the roll-up film (28) directly and continuously on contacts (46, 48 or 58, 60) of the electronic device.

摘要翻译： 本发明涉及一种从硅晶片（10）提取芯片（20）并将每个芯片传送到电子设备上的方法，包括以下步骤：从硅晶片（10）中提取好的芯片， 将片状物（20）从卷绕膜（28）直接连续地传送到电子部件（46,48或58,60）的接触件（46,48或58,60）上， 设备。

公开(公告)号：US5660919A

公开(公告)日：1997-08-26

申请号：US250106

申请日：1994-05-26

申请人： Antoine Vallee ,  Christophe Halope

发明人： Antoine Vallee ,  Christophe Halope

IPC分类号： B41M1/10 ,  B41M3/14 ,  B41M5/00 ,  B41M5/52 ,  B42D15/00 ,  D21H21/40 ,  D21H19/36

CPC分类号： B41M5/52 ,  B41M1/10 ,  B42D25/29 ,  D21H21/40 ,  B41M3/14 ,  B41M5/5218 ,  B41M5/5227 ,  B41M5/5281 ,  Y10T428/24893 ,  Y10T428/24901 ,  Y10T428/24909 ,  Y10T428/24934 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/31591

摘要： A printable sheet having a high printing quality and a high handling resistance. At least one of the sides of the sheet is treated with a composition which comprises at least one filler and at least one elastomeric binder. The elastomeric binder is selected from the group consisting of aqueous dispersions of polyurethane, acrylate copolymers, optionally carboxylated styrene-butadiene copolymers, and polymers of which one of the monomers is acrylonitrile, isoprene, or neoprene, or mixtures thereof. The sheet can be used for manufacturing protected documents.

摘要翻译： 具有高印刷质量和高耐操作性的可印刷片材。 用包含至少一种填料和至少一种弹性粘合剂的组合物处理片材的至少一个侧面。 弹性体粘合剂选自聚氨酯的水分散体，丙烯酸酯共聚物，任选的羧化苯乙烯 - 丁二烯共聚物，以及其中一种单体是丙烯腈，异戊二烯或氯丁橡胶或其混合物的聚合物。 该纸张可用于制造受保护的文件。

公开(公告)号：US20150244727A1

公开(公告)日：2015-08-27

申请号：US14427211

申请日：2013-09-11

申请人： Thierry FOURNEL ,  Pierre-Jean ARNAUD ,  Michel CAMUS ,  Christophe HALOPE ,  Jacques MACHIZAUD ,  ARJOWIGGINS SECURITY ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  UNIVERSITE JEAN MONNET, SAINT-E-TIENNE

发明人： Thierry Fournel ,  Michel Camus ,  Christophe Halope ,  Mathieu Hebert ,  Jacques MacHizaud

IPC分类号： H04L29/06 ,  B42D25/328 ,  H04N1/405 ,  H04L9/08 ,  H04N1/60

CPC分类号： B42D25/305 ,  B42D25/21 ,  B42D25/29 ,  B42D25/328 ,  B42D25/351 ,  B42D25/405 ,  B42D2035/24 ,  B42D2035/26 ,  B42D2035/34 ,  G07D7/0056 ,  G09C5/00 ,  H04L9/088 ,  H04L63/123 ,  H04L2209/046 ,  H04N1/405 ,  H04N1/60 ,  H04N1/6097

摘要： A method for authenticating a security element by superimposing N shared colour images in order to obtain at least one target colour may include a phase of constructing an authenticator system that includes a step of selecting a target colour; a step of selecting a series of N decomposition colours which, by means of superimposition, together enable the target colour to be obtained; and a step of recording the N shared images each with a decomposition colour from the series. A security element comprising at least one shared image may be obtained according to the method.

摘要翻译： 用于通过叠加N个共享彩色图像以获得至少一个目标颜色来认证安全元件的方法可以包括构建认证器系统的阶段，其包括选择目标颜色的步骤; 选择通过叠加一起使得能够获得目标颜色的一系列N分解颜色的步骤; 以及将来自该系列的分解颜色各自记录的N个共享图像的步骤。 可以根据该方法获得包括至少一个共享图像的安全元件。

公开(公告)号：US07688209B2

公开(公告)日：2010-03-30

申请号：US11337534

申请日：2006-01-24

申请人： Christophe Halope

发明人： Christophe Halope

IPC分类号： G08B13/14

CPC分类号： G06K19/02 ,  B42D25/00 ,  B42D25/22 ,  B42D25/24 ,  B42D2033/46 ,  G06K19/025 ,  G06K19/07749 ,  Y10T428/24719 ,  Y10T428/28 ,  Y10T428/2804

摘要： The invention concerns a radio frequency identification device (RFID) featuring an antenna (12) screen-printed on a fibrous support and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to the main characteristic of the invention, a thermoplastic layer (22) and a layer of paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and so that the device is resistant to water and humid environments.

摘要翻译： 本发明涉及一种射频识别装置（RFID），其特征在于丝网印刷在纤维载体上的天线（12）和连接到天线的连接端子（17和19）的芯片（10）。 根据本发明的主要特征，热塑性层（22）和纸层（24）层叠在天线支架（20）上，使得天线和芯片被捕获在热塑性塑料中，使得该装置是 耐水和潮湿的环境。