公开(公告)号：US20120299204A1

公开(公告)日：2012-11-29

申请号：US13116585

申请日：2011-05-26

Applicant: Chui Fu Chiu

Inventor： Chui Fu Chiu

IPC: H01L23/544 ,  H01L21/71

CPC classification number: G03F7/70633

Abstract: A method for fabricating an overlay mark, including the steps of: forming a patterned layer on a substrate, wherein the patterned layer comprises at least one mark element forming region, wherein each mark element forming region comprises two column recesses and a plurality of row recesses, and the row recesses connect the two column recesses; growing a mark material from the sidewalls of the column recesses and the row recesses so that the mark material merges in the column recesses and the row recesses; and removing the patterned layer. Consequently, an overlay mark including mark elements with high image contrast is fabricated.

Abstract translation: 一种用于制造覆盖标记的方法，包括以下步骤：在衬底上形成图案化层，其中所述图案化层包括至少一个标记元件形成区域，其中每个标记元件形成区域包括两个列凹槽和多个行凹槽 并且行凹槽连接两个柱凹槽; 从柱凹槽和排凹槽的侧壁生长标记材料，使得标记材料合并在柱凹槽和排凹槽中; 并去除图案层。 因此，制造包括具有高图像对比度的标记元素的重叠标记。

公开(公告)号：US20130147129A1

公开(公告)日：2013-06-13

申请号：US13314684

申请日：2011-12-08

Applicant: Chui Fu Chiu

Inventor： Chui Fu Chiu

IPC: H01L21/58 ,  B25B11/00

CPC classification number: H01L21/6831 ,  H01L21/6838 ,  H01L21/68742 ,  Y10T279/11 ,  Y10T279/23

Abstract: A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a surface and configured to receive a wafer thereon, the plurality of pin holes form through the chuck, and the platform comprises a plurality of movable pieces which support corresponding pins, wherein the pins are configured to move in a direction perpendicularly protruding from or sinking into the surface of the chuck. The movable piece has one end supporting the bottom of the pin and the other end subjected to an pneumatic pressure, hydraulic pressure, or piezoelectricity.

Abstract translation: 一种用于改善晶片的临界尺寸均匀性的晶片支撑结构，包括：卡盘，多个销孔和位于卡盘下方的平台。 小鸡具有表面并被配置为在其上接收晶片，多个针孔通过卡盘形成，并且平台包括支撑相应销的多个可动件，其中销构造成沿垂直于 或沉入卡盘的表面。 可动件具有支撑销底部的一端，另一端承受气压，液压或压电性。