公开(公告)号：US20110272769A1

公开(公告)日：2011-11-10

申请号：US13144587

申请日：2010-02-11

申请人： Chung-Dam Song ,  Chang-Won Kim ,  Jung-Min Kim ,  Won-Taek Lee ,  Sung-Ho Park

发明人： Chung-Dam Song ,  Chang-Won Kim ,  Jung-Min Kim ,  Won-Taek Lee ,  Sung-Ho Park

IPC分类号： H01L29/84 ,  H01L21/58

CPC分类号： H04R19/005 ,  B81B7/0061 ,  B81B2201/0257 ,  H04R19/04 ,  H04R31/00

摘要： A MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and external air pressure. The MEMS microphone package includes a MEMS microphone chip, in which a back plate and a diaphragm structure are formed in a body by using MEMS process techniques; a substrate for mounting the MEMS microphone chip thereon; a vent path which is formed between the MEMS microphone chip and the substrate by applying an adhesive only to a portion of the substrate and adhering the MEMS microphone chip to the substrate; and a case which is adhered to the substrate and forms a space for accommodating the MEMS microphone chip, wherein acoustic properties of the MEMS microphone package are improved as air pressure inside the MEMS microphone chip and air pressure outside the MEMS microphone chip form air equilibrium via the vent path.

摘要翻译： 具有改进的声学性质的MEMS麦克风封装以及包装方法，其包括在包装过程中增加通气路径以改善内部和外部空气压力之间的平衡。 MEMS麦克风封装包括MEMS麦克风芯片，其中通过使用MEMS工艺技术在主体中形成背板和隔膜结构; 用于在其上安装MEMS麦克风芯片的基板; 通过将粘合剂仅施加到基板的一部分并将MEMS麦克风芯片粘附到基板上而形成在MEMS麦克风芯片和基板之间的通气路径; 以及附着在基板上并形成用于容纳MEMS麦克风芯片的空间的壳体，其中MEMS麦克风封装的声学特性随着MEMS麦克风芯片内部的气压和MEMS麦克风芯片之外的气压而形成空气平衡 通风道。

公开(公告)号：US20110182448A1

公开(公告)日：2011-07-28

申请号：US12993315

申请日：2009-05-13

申请人： Won-Taek Lee ,  Chang-Won Kim ,  Jung-Min Kim ,  Hyung-Joo Kim

发明人： Won-Taek Lee ,  Chang-Won Kim ,  Jung-Min Kim ,  Hyung-Joo Kim

IPC分类号： H04R1/00

CPC分类号： H04R7/06 ,  H04R19/04

摘要： The present invention relates to a spacer-integrated diaphragm, in which spacers are integrated with the diaphragm, in order to reduce the number of components and manufacturing processes needed and remove parasitic capacitance. A characterizing feature of the spacer-integrated diaphragm of the present invention is that it has an integrated structure comprising a diaphragm of a flat conductive film, and thermally insulative spacers formed so as to protrude on peripheral portions of the diaphragm through a PSR (Photo Solder Resist) printing process. The spacers are formed with a plurality of holes to remove parasitic capacitance, the diaphragm has a rectangular flat shape with round edges, and the spacers are formed near the four edges of the rectangular flat shape. In the spacer-integrated diaphragm of the present invention, because the spacers are formed of a PSR (Photo Solder Resist) material and are also formed with a plurality of holes, the present invention can prevent unnecessary parasitic capacitance from occurring and improve sound quality, and, because the diaphragm and the spacers are integrally formed, the present invention can reduce the number of processes needed when a condenser microphone is assembled and reduce the number of components required, thereby reducing manufacturing costs.

摘要翻译： 本发明涉及一种间隔件集成隔膜，其中间隔件与隔膜结合在一起，以减少所需的部件数量和制造工艺，并消除寄生电容。 本发明的隔离件一体式隔膜的特征在于其具有包括平面导电膜的隔膜的整体结构和通过PSR（Photo Solder）在隔膜的周边部分上突出形成的隔热隔离物 抗拒）印刷工艺。 间隔件形成有多个孔以去除寄生电容，隔膜具有圆形边缘的矩形平面形状，并且间隔件形成在矩形平面形状的四个边缘附近。 在本发明的间隔物一体化隔膜中，由于间隔物由PSR（Photo Solder Resist）材料形成，并且还形成有多个孔，因此本发明可以防止发生不必要的寄生电容并提高声音质量， 并且由于隔膜和间隔件是整体形成的，所以本发明可以减少组装电容麦克风所需的处理次数，并减少所需部件的数量，从而降低制造成本。

公开(公告)号：US06818092B2

公开(公告)日：2004-11-16

申请号：US10135033

申请日：2002-04-29

申请人： Keum-Haeng Cho ,  Won-Taek Lee

发明人： Keum-Haeng Cho ,  Won-Taek Lee

IPC分类号： B32B3120

CPC分类号： B32B37/02 ,  B32B15/08 ,  B32B27/06 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2327/12 ,  B32B2327/18 ,  H01G7/02 ,  H01G7/023 ,  H04R19/016 ,  H04R31/00 ,  Y10T29/49226 ,  Y10T428/3154

摘要： A multi-layer electret that can endure a high temperature so as to be processed by surface mount technology (SMT) and has ultra-high charge stability and a method of manufacturing thereof are provided. The multi-layer electret is constructed in such a manner that an FET film of 12.5 &mgr;m˜25 &mgr;m in thickness melting-adheres to a surface of a metal plate, and a PTFE film of 30 &mgr;m˜100 &mgr;m in thickness melting-adheres to the surface of the FEP film. A method of manufacturing the multi-layer electret having ultra-high charge stability comprises a first step of laminating an FEP film on a metal plate; a second step of heating the metal plate on which the FEP film was laminated at a high temperature and applying high pressure thereto, whereby the FEP film and the metal plate melting-adhere to each other; a third step of laminating a PTFE film on the FEP film attached to the metal plate; a fourth step of heating the laminated structure and applying high pressure thereto, whereby the PTFE film melting-adheres to the FEP film; a fifth step of cooling the resulting structure, to accomplish an electret; and a sixth step of charging the cooled electret with charges.

摘要翻译： 提供能够耐受高温以便通过表面贴装技术（SMT）加工并具有超高电荷稳定性的多层驻极体及其制造方法。 多层驻极体的构成是将12.5μm〜25μm厚的FET薄膜熔融粘附到金属板的表面，将30μm〜100μm的PTFE薄膜熔融粘附至 FEP膜的表面。 制造具有超高电荷稳定性的多层驻极体的方法包括：在金属板上层压FEP膜的第一步骤; 在高温下加热层叠有FEP膜的金属板并向其施加高压的第二工序，FEP膜和金属板彼此熔融粘合; 在连接到金属板的FEP膜上层压PTFE膜的第三步骤; 第四步骤是对叠层结构加热并施加高压，由此PTFE膜熔融粘附到FEP膜上; 第五步骤冷却所得结构，完成驻极体; 以及向冷却的驻极体充电的第六步骤。