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公开(公告)号：US12096601B2
公开(公告)日：2024-09-17
申请号：US17742596
申请日：2022-05-12
申请人： Ciena Corporation
CPC分类号： H05K7/2049 , H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2023/4087
摘要： A backing plate assembly with jack screw for bare die device heat sink applications to ensure uniform loading. The jack screw is used to force a PCB support plate and mounting plate apart, and by doing so, compresses a plurality of springs and applies uniform pressure to the heat sink, which in turn applies pressure to the bare die of the BGA device. The single jack screw is essential to the design, as it creates a single point to apply torque and compress all the springs at the same time. A lock screw is meant to maintain the position of the PCB support plate and the mounting plate. Prior to assembly, the lock screw keeps the PCB support plate and mounting plate together to ease installation.
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2.发明公开公开(公告)号：US20230371208A1
公开(公告)日：2023-11-16
申请号：US17742596
申请日：2022-05-12
申请人： Ciena Corporation
CPC分类号： H05K1/021 , H05K7/2049 , H05K7/20418 , H05K2201/066
摘要： A backing plate assembly with jack screw for bare die device heat sink applications to ensure uniform loading. The jack screw is used to force a PCB support plate and mounting plate apart, and by doing so, compresses a plurality of springs and applies uniform pressure to the heat sink, which in turn applies pressure to the bare die of the BGA device. The single jack screw is essential to the design, as it creates a single point to apply torque and compress all the springs at the same time. A lock screw is meant to maintain the position of the PCB support plate and the mounting plate. Prior to assembly, the lock screw keeps the PCB support plate and mounting plate together to ease installation.
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