公开(公告)号：US20240012035A1

公开(公告)日：2024-01-11

申请号：US18347715

申请日：2023-07-06

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Kapil R. SHARMA ,  Kathryn R. HOLLAND ,  Matthew PETHERBRIDGE ,  Peter HSU ,  John B. BOWLERWELL

IPC: G01R19/00

CPC classification number: G01R19/0092

Abstract: This application relates to methods and apparatus for sensing current in a monitored current path, where the monitored current path is bidirectional such that current can flow in either direction along the monitored current path. A current sensor has first and second sense resistors (401a, 401b) configured to each pass a current corresponding to the current in the monitored current path. The first and second sense resistors are configured to have a matching arrangement, such that current flow through the first sense resistor when current is flowing in one direction in the monitored current path matches current flow through the second sense resistor when current is flowing in the opposite direction in the monitored current path.

公开(公告)号：US20240154612A1

公开(公告)日：2024-05-09

申请号：US18483727

申请日：2023-10-10

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Kapil SHARMA ,  Andrew J. HOWLETT ,  Matthew PETHERBRIDGE ,  John B. BOWLERWELL ,  Graeme S. ANGUS ,  Gordon RUSSELL

IPC: H03K17/687

CPC classification number: H03K17/6871

Abstract: The application relates to voltage supply in switched-mode driver integrated circuit (IC). The IC has an output bridge with first and second circuit branches, where each of the circuit branches has an output node (102a, 102b) connected between first and second transistor switches (103a, 104a; 103b, 104b) for selectively connecting the output node to respective first and second voltages (VH, VL). There are discrete first and second IC die contacts (208a, 208b) for receiving the first voltage, and the first and second circuit branches are connected to the first and second IC die contacts respectively. Ancillary circuitry (105) is configured to receive a supply voltage from a voltage supply node voltage which is connected to the first and second IC die contacts via respective first and second respectively matched resistances.