公开(公告)号：US20220181807A1

公开(公告)日：2022-06-09

申请号：US17333925

申请日：2021-05-28

申请人： Cisco Technology, Inc.

发明人： Jason Visneski ,  George Edward Curtis ,  Mike Sapozhnikov ,  Peter Gunadisastra ,  Joel Goergen

IPC分类号： H01R12/53 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34

摘要： An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.

公开(公告)号：US11482802B2

公开(公告)日：2022-10-25

申请号：US17333925

申请日：2021-05-28

申请人： Cisco Technology, Inc.

发明人： Jason Visneski ,  George Edward Curtis ,  Mike Sapozhnikov ,  Peter Gunadisastra ,  Joel Goergen

IPC分类号： H05K1/11 ,  H05K3/34 ,  H01R12/53 ,  H05K1/18

摘要： An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.