RACK-MOUNTABLE HEAT-EXCHANGER FOR MODULAR ELECTRONIC SYSTEMS

    公开(公告)号:US20230389235A1

    公开(公告)日:2023-11-30

    申请号:US18448778

    申请日:2023-08-11

    CPC classification number: H05K7/20736 H05K7/20836 H05K7/20145

    Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

    RACK-MOUNTABLE HEAT-EXCHANGER FOR MODULAR ELECTRONIC SYSTEMS

    公开(公告)号:US20220201901A1

    公开(公告)日:2022-06-23

    申请号:US17445470

    申请日:2021-08-19

    Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

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