RACK-MOUNTABLE HEAT-EXCHANGER FOR MODULAR ELECTRONIC SYSTEMS

    公开(公告)号:US20220201901A1

    公开(公告)日:2022-06-23

    申请号:US17445470

    申请日:2021-08-19

    Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

    RACK-MOUNTABLE HEAT-EXCHANGER FOR MODULAR ELECTRONIC SYSTEMS

    公开(公告)号:US20230389235A1

    公开(公告)日:2023-11-30

    申请号:US18448778

    申请日:2023-08-11

    CPC classification number: H05K7/20736 H05K7/20836 H05K7/20145

    Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

    GROUND CONNECTION DETECTION IN AN ELECTRONIC EQUIPMENT

    公开(公告)号:US20230065681A1

    公开(公告)日:2023-03-02

    申请号:US17445999

    申请日:2021-08-26

    Abstract: Embodiments presented in this disclosure generally relate to a ground device. More specifically, embodiments disclosed herein are directed to a grounding device for indicating whether there is proper grounding for electrical equipment. One embodiment presented in this disclosure provides an apparatus. The apparatus generally includes a lug configured to be coupled to a physical ground node, the lug having one or more bolts for coupling the lug to a surface of a plate such that the physical ground node is electrically coupled to an electrical ground node. The apparatus also includes a sensing circuit configured to detect whether the physical ground node is electrically coupled to the electrical ground node, and provide an indication of whether the physical ground node is electrically coupled to the electrical ground node based on the detection.

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