公开(公告)号：US20240332154A1

公开(公告)日：2024-10-03

申请号：US18190911

申请日：2023-03-27

Applicant: Cisco Technology, Inc.

Inventor： Wenbin MA ,  Yuqing ZHU ,  Weiying DING ,  Mingtong ZUO ,  Mike SAPOZHNIKOV ,  Srinath PENUGONDA ,  David NOZADZE

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1413 ,  H01L2224/16227

Abstract: A printed circuit board includes a grid of pads and tracks. The grid of pads includes a first pair of adjacent signal pads arranged in a first column and a second pair of adjacent signal pads arranged in a first row. A first signal pad of the second pair is arranged in the first column. The grid of pads also includes a third pair of adjacent signal pads arranged in a second row. A second signal pad of the first pair is arranged in the second row. The grid of pads further includes a fourth pair of adjacent signal pads arranged in a second column. A third signal pad of the third pair is arranged in the second column. A fourth signal pad of the fourth pair is arranged in the first row. The tracks are electrically coupled to the first, second, third, and fourth pairs.