Shieldless, high-speed electrical connectors
    5.
    发明申请
    Shieldless, high-speed electrical connectors 有权
    无屏蔽,高速电气连接器

    公开(公告)号:US20060234531A1

    公开(公告)日:2006-10-19

    申请号:US11326061

    申请日:2006-01-05

    IPC分类号: H01R13/648

    摘要: An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array includes a first differential signal pair, a first ground contact lead adjacent to the first differential signal pair, and a second ground contact lead adjacent to the first ground contact lead. The second linear array is positioned adjacent to the first linear array, and includes a second differential signal pair, a third ground contact lead adjacent to the second differential signal pair, and a fourth ground contact lead adjacent to the third ground contact lead. The electrical connector is devoid of electrical shields between the first linear array and the second linear array.

    摘要翻译: 公开了一种包括电触点的第一和第二线性阵列的电连接器。 第一线性阵列包括第一差分信号对,与第一差分信号对相邻的第一接地引线和与第一接地引线相邻的第二接地引线。 第二线性阵列与第一线性阵列相邻,并且包括第二差分信号对,与第二差分信号对相邻的第三接地引线,以及与第三接地引线相邻的第四接地引线。 电连接器在第一线性阵列和第二线性阵列之间没有电气屏蔽。

    Shieldless, High-Speed Electrical Connectors
    6.
    发明申请
    Shieldless, High-Speed Electrical Connectors 有权
    无屏蔽,高速电气连接器

    公开(公告)号:US20070099464A1

    公开(公告)日:2007-05-03

    申请号:US11610678

    申请日:2006-12-14

    IPC分类号: H01R13/62

    摘要: An electrical connector having a leadframe housing, a first electrical contact fixed in the leadframe housing, a second electrical contact fixed adjacent to the first electrical contact in the leadframe housing, and a third electrical contact fixed adjacent to the second electrical contact in the leadframe housing is disclosed. Each of the first and second electrical contacts may be selectively designated, while fixed in the lead frame housing, as either a ground contact or a signal contact such that, in a first designation, the first and second contacts form a differential signal pair, and, in a second designation, the second contact is a single-ended signal conductor. The third electrical contact may be a ground contact having a terminal end that extends beyond terminal ends of the first and second contacts.

    摘要翻译: 一种电连接器,具有引线框架壳体,固定在引线框架壳体中的第一电触点,与引线框架壳体中的第一电触头相邻固定的第二电触头,以及与引线框壳体中的第二电触头相邻固定的第三电触点 被披露。 第一和第二电触头中的每个可以被选择性地指定为固定在引线框架壳体中,作为接地触点或信号触点,使得在第一指定中,第一和第二触点形成差分信号对,以及 在第二指定中,第二触点是单端信号导体。 第三电触点可以是具有延伸超过第一和第二触点的终端的终端的接地触头。

    Modular electrical connector
    7.
    发明申请
    Modular electrical connector 失效
    模块化电连接器

    公开(公告)号:US20050020134A1

    公开(公告)日:2005-01-27

    申请号:US10626960

    申请日:2003-07-24

    摘要: A preferred embodiment of a modular electrical connector includes a plug having a printed circuit board, a contact finger positioned on a portion of the printed circuit board, and a housing for supporting and constraining the printed circuit board so that the portion of the printed circuit board extends from the housing. The printed circuit board has a flexible portion that permits the portion of the printed circuit board to translate in relation to the housing. The modular electrical connector also includes a receptacle for mating with the plug and having a first contact for electrically contacting the contact finger when the plug and the receptacle are mated, and a housing having a slot formed therein for receiving the portion of the printed circuit board when the plug and the receptacle are mated.

    摘要翻译: 模块化电连接器的优选实施例包括具有印刷电路板,位于印刷电路板的一部分上的接触爪的插头和用于支撑和约束印刷电路板的壳体,使得印刷电路板的一部分 从房屋延伸。 印刷电路板具有允许印刷电路板的部分相对于外壳平移的柔性部分。 所述模块化电连接器还包括用于与所述插头配合的插座,并且具有用于当所述插头和所述插座配合时电接触所述接触指状物的第一触点;以及壳体,其中形成有用于容纳所述印刷电路板的所述部分的槽 当插头和插座配合时。

    High-Frequency, High-Signal-Density, Surface-Mount Technology Footprint Definitions
    10.
    发明申请
    High-Frequency, High-Signal-Density, Surface-Mount Technology Footprint Definitions 有权
    高频,高信号密度,表面贴装技术脚印定义

    公开(公告)号:US20060231833A1

    公开(公告)日:2006-10-19

    申请号:US11287951

    申请日:2005-11-28

    IPC分类号: H01L23/58

    摘要: Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ from the arrangement of contacts in a connector the footprint is designed to receive. The terminal ends of the contacts may be jogged or bent for electrical connection with the SMT pads. The SMT pads and vias may be arranged in a number of ways that increase signal contact density of the board, while limiting cross-talk and providing adequate impedance and routing space on the board. An interactive tool for designing such a footprint is disclosed.

    摘要翻译: 公开了设计SMT连接器脚印的方法。 电路板可以在其上设置有SMT焊盘和对应的通孔的布置。 通孔的布置可能不同于SMT焊盘的布置。 SMT焊盘的布置可能不同于封装设计用于接收的连接器中的触点布置。 触点的端子可以被点动或弯曲以与SMT焊盘电连接。 SMT焊盘和通孔可以以增加板的信号接触密度的多种方式布置,同时限制串扰并且在板上提供足够的阻抗和布线空间。 公开了一种用于设计这种足迹的交互式工具。