公开(公告)号：US20240329090A1

公开(公告)日：2024-10-03

申请号：US18526390

申请日：2023-12-01

Applicant: Schneider Electric USA, Inc.

Inventor： Adrian Abdala Rendon Hernandez ,  Juan Ignacio Melecio Ramirez ,  Collin Richard Fischels

IPC: G01R15/18 ,  G01R19/25 ,  H05K1/02 ,  H05K1/11

CPC classification number: G01R15/181 ,  G01R19/2513 ,  H05K1/0216 ,  H05K1/116 ,  G01R31/52 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/10151

Abstract: A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.

公开(公告)号：US20240268033A1

公开(公告)日：2024-08-08

申请号：US18436098

申请日：2024-02-08

Applicant: Robert Bosch GmbH

Inventor： Florian Eichkorn

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/10181 ,  H05K2201/10803

Abstract: A flexible printed circuit board, in particular for connecting electrical and/or electronic components, includes a fuse conductor track (10). The fuse conductor track has a conductor width (B1) formed on the flexible printed circuit board (1). The fuse conductor track (10) has a taper (12) in a fuse area (11) of the fuse conductor track (10), at which the fuse conductor track (10) has a fuse width (B2) which is smaller than the conductor width (B1) of the fuse conductor track (10) outside the fuse area (11).

公开(公告)号：US11852930B2

公开(公告)日：2023-12-26

申请号：US16903449

申请日：2020-06-17

Applicant: Samsung Display Co., Ltd.

Inventor： Jin Hee Bae ,  Min Ho Kim ,  Kyung Ha Moon ,  Bum Suk Lee ,  Nak Sung Choi

IPC: G02F1/1345 ,  G09G3/36 ,  G02F1/1333 ,  H05K1/18 ,  H05K1/11

CPC classification number: G02F1/13452 ,  G02F1/13458 ,  G02F1/133345 ,  G09G3/3696 ,  H05K1/118 ,  H05K1/189 ,  G09G2300/0426 ,  G09G2300/0478 ,  G09G2310/0278 ,  H05K2201/09236 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A display device is provided. A display device includes a display panel including a plurality of connecting signal wires which supply different control voltages; a flexible printed circuit board attached to a side surface of the display panel and including a base film and a plurality of lead wires which are disposed on the base film; an anisotropic conductive film disposed between the plurality of connecting signal wires and the plurality of lead wires, and at least one bump wire disposed between adjacent connecting signal wires, the at least one bump wire being not supplied with the different control voltages controlling the display panel.

公开(公告)号：US11710929B2

公开(公告)日：2023-07-25

申请号：US17340309

申请日：2021-06-07

Applicant: Dongguan Luxshare Technologies Co., Ltd

Inventor： Xiaogang Liu ,  Rongzhe Guo ,  Kun Liu ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

公开(公告)号：US11699881B2

公开(公告)日：2023-07-11

申请号：US17340369

申请日：2021-06-07

Applicant: Dongguan Luxshare Technologies Co., Ltd

Inventor： Xiaogang Liu ,  Rongzhe Guo ,  Kun Liu ,  Chuanqi Gong ,  Tao Song

IPC: H01R13/6471 ,  H01R13/40 ,  H01R13/6587 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6585 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A terminal module includes a number of conductive terminals and an insulating frame. Each conductive terminal includes a contact portion. The conductive terminals include a first signal terminal and a second signal terminal. The contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The terminal module includes an insulating block sleeved on the first contact arm and the second contact arm, and a metal shield surrounding member sleeved on the insulating block. The insulating block includes a limiting groove and the metal shield surrounding member includes a limiting protrusion protruding into the limiting groove. As a result, it facilitates to assemble the insulating block and the metal shield surrounding member. The present disclosure also relates to a backplane connector having the terminal module.

公开(公告)号：US20180242444A1

公开(公告)日：2018-08-23

申请号：US15900484

申请日：2018-02-20

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Kentaro TODA ,  Kenji ARAI ,  Manabu MIYAZAWA ,  Kenichiro NAGATOMO ,  Touru UENO ,  Tsuguto MARUKO ,  Hirofumi OGAWA ,  Tetsuo OOMORI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/114 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/10015 ,  H05K2201/10689

Abstract: A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

公开(公告)号：US20180206332A1

公开(公告)日：2018-07-19

申请号：US15923048

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K1/0225 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0044 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09327

Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.

公开(公告)号：US20180096764A1

公开(公告)日：2018-04-05

申请号：US15283350

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Donald S. GARDNER ,  Gerhard SCHROM ,  Edward A. BURTON

IPC: H01F1/147 ,  H01F27/255 ,  H01F10/06 ,  H01F27/28 ,  H01F41/04 ,  H01F41/16 ,  H01F41/26 ,  H01F41/32 ,  H05K3/00 ,  H01L23/64 ,  H01L49/02 ,  H01L25/18

CPC classification number: H01F1/14733 ,  H01F10/06 ,  H01F17/0006 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/365 ,  H01F41/041 ,  H01F41/046 ,  H01F41/16 ,  H01F41/18 ,  H01F41/26 ,  H01F41/32 ,  H01F2017/0066 ,  H01L23/552 ,  H01L23/645 ,  H01L25/18 ,  H01L28/10 ,  H05K1/165 ,  H05K3/0085 ,  H05K2201/086 ,  H05K2201/09236

Abstract: Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

公开(公告)号：US09928400B2

公开(公告)日：2018-03-27

申请号：US15271420

申请日：2016-09-21

Applicant: KYOCERA Corporation

Inventor： Kohichi Ohsumi

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  G06K9/00 ,  H05K1/03 ,  H05K3/46 ,  H05K1/16

CPC classification number: G06K9/0002 ,  H05K1/0366 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/017 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/10151

Abstract: A wiring board for a fingerprint sensor includes a core insulating layer having a thickness of 30 μm to 100 μm, an inner buildup insulating layer having a thickness of 17 μm to 35 μm, an outer buildup insulating layer having a thickness of 7 μm to 25 μm, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and an upper solder resist layer covering the outer strip-shaped electrodes by a thickness of 3 μm to 15 μm.

公开(公告)号：US20180063947A1

公开(公告)日：2018-03-01

申请号：US15470309

申请日：2017-03-27

Applicant: Wistron Corporation

Inventor： Tien-Chung TSENG ,  Chen-Chieh LIEN

IPC: H05K1/02 ,  H05K1/11 ,  H05K5/00 ,  H05K5/03 ,  H05K7/14 ,  G01L1/20

CPC classification number: H05K1/0275 ,  G01L1/20 ,  H05K1/111 ,  H05K1/16 ,  H05K1/181 ,  H05K5/0047 ,  H05K5/0208 ,  H05K5/03 ,  H05K7/1427 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10053

Abstract: A pressure sensing module for sensing a pressure applied to a circuit board is disclosed, The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.