公开(公告)号：US20040108215A1

公开(公告)日：2004-06-10

申请号：US10407455

申请日：2003-04-07

Applicant: Com Dev Ltd.

Inventor： James Jacob Donaldson ,  Bruce William Clark

IPC: C25D005/02 ,  C25D017/00

CPC classification number: C25D5/02 ,  C25D7/04 ,  C25D17/10

Abstract: An electroplating anode assembly and method for electroplating the plating area of a work-piece. The assembly includes a conductive element and a helical insulating coil. The conductive element can either be a straight conductive wire or a helically coiled conductive wire. The insulating coil is substantially equal in length to the conductive element and positioned around the conductive element for preventing the conductive element from contacting the plating area of the work-piece. The insulating coil extends continuously along the length of the entire electroplating portion of the conductive element. The anode assembly can be used to achieve uniform and adequate electroplating surfaces within recessed and enclosed plating areas of work-pieces that are conventionally difficult to electroplate due to its ability to be readily manipulated into various shapes. Further, anode assembly can be readily repositioned during the course of electroplating to further reduce the instance of localized areas of thick/thin deposition.

Abstract translation: 一种用于电镀工件电镀区域的电镀阳极组件和方法。 组件包括导电元件和螺旋绝缘线圈。 导电元件可以是直线导线或螺旋线圈导电线。 绝缘线圈的长度与导电元件基本相同，并且位于导电元件周围，以防止导电元件接触工件的电镀区域。 绝缘线圈沿着导电元件的整个电镀部分的长度连续延伸。 阳极组件可用于在通常难以电镀的工件的凹陷和封闭的电镀区域内实现均匀且充分的电镀表面，因为其能够容易地操纵成各种形状。 此外，阳极组件可以在电镀过程中容易地重新定位，以进一步减少厚/薄沉积的局部区域的实例。