SMALL CELL WIRELESS COMMUNICATION DEVICES HAVING ENHANCED BEAMSTEERING CAPABILITY AND METHODS OF OPERATING SAME

    公开(公告)号:US20220029290A1

    公开(公告)日:2022-01-27

    申请号:US17413980

    申请日:2019-12-04

    Abstract: A small cell wireless communication device includes an antenna having an array of radiating elements, a control circuit, and a transceiver/radio. The transceiver is electrically coupled to the antenna by an array of phase shifters, which are responsive to control signals that encode phase weight information and enable the array of phase shifters and the array of radiating elements to collectively perform elevation beamsteering of wireless signals generated by the transceiver, in response to signals generated by the control circuit upon movement of the antenna. In some instances, these signals generated by the control circuit may include an elevation beam index, which may operate as a pointer into a look-up table, which stores phase-weights to be provided to the array of phase shifters.

    MULTI-BAND BASE STATION ANTENNAS HAVING INTERLEAVED ARRAYS

    公开(公告)号:US20210391655A1

    公开(公告)日:2021-12-16

    申请号:US17284846

    申请日:2020-01-28

    Abstract: Base station antennas are provided herein. A base station antenna includes one or more vertical columns of low-band radiating elements configured to transmit RF signals in a first frequency band. The base station antenna also includes a plurality of vertical columns of high-band radiating elements configured to transmit RF signals in a second frequency band that is higher than the first frequency band. The vertical columns of high-band radiating elements extend in parallel with the one or more vertical columns of low-band radiating elements in a vertical direction.

    VERTICAL TRANSITIONS FOR MICROWAVE AND MILLIMETER WAVE COMMUNICATIONS SYSTEMS HAVING MULTI-LAYER SUBSTRATES

    公开(公告)号:US20200303799A1

    公开(公告)日:2020-09-24

    申请号:US16755921

    申请日:2018-10-12

    Abstract: Radio frequency transmission lines in a multi-layer printed circuit board structure include first and second rows of ground vias that extend vertically through the printed circuit board structure. A first transmission line segment extends horizontally along a first portion of the multi-layer printed circuit board structure and a second transmission line segment extends horizontally along a second portion of the multi-layer printed circuit board structure, the second transmission line segment vertically spaced apart from the first transmission line segment. A vertical dielectric structure extends between the first and second transmission line segments and a blind ground via extends vertically through the printed circuit board structure adjacent the vertical dielectric structure.

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