公开(公告)号：US20180014434A1

公开(公告)日：2018-01-11

申请号：US15642937

申请日：2017-07-06

Applicant: CommScope Technologies LLC

Inventor： Thomas F. Craft, JR. ,  Alan James Skrepcinski ,  Patrick Eugene Yantz

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/1497 ,  H05K7/20136 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/2079 ,  H05K7/20836

Abstract: The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.