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公开(公告)号:US20240203731A1
公开(公告)日:2024-06-20
申请号:US18537875
申请日:2023-12-13
发明人: Rémy Gassilloud , Julien Patouillard , Bérangére Hyot , Amélie Dussaigne , Stéphane Cadot , Matthew Charles , François Martin , Nicolas Gauthier , Christine Raynaud
IPC分类号: H01L21/02
CPC分类号: H01L21/0254 , H01L21/02529 , H01L21/02568 , H01L21/02581 , H01L21/02631 , H01L21/02664
摘要: A method including the following successive steps: a) forming, on a surface of a support substrate, a first layer made of a material selected from among a lamellar dichalcogenide or a lamellar chalcogenide including a stack of sheets; b) forming, by physical vapor deposition on the side of said surface of the support substrate, a second layer made of a first III-N semiconductor material coating the first layer; and c) carrying out a thermo-chemical treatment of the first layer resulting, in the first layer, in a conversion of van der Waals bonds between the sheets of the first layer into covalent bonds.