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公开(公告)号:US10784103B2
公开(公告)日:2020-09-22
申请号:US16128120
申请日:2018-09-11
Applicant: Complete Genomics, Inc.
Inventor: Shifeng Li , Jian Gong , Yan-You Lin , Cheng Frank Zhong
Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.
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公开(公告)号:US20190088463A1
公开(公告)日:2019-03-21
申请号:US16128120
申请日:2018-09-11
Applicant: Complete Genomics, Inc.
Inventor: Shifeng Li , Jian Gong , Yan-You Lin , Cheng Frank Zhong
Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.
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