DI metal transaction devices and processes for the manufacture thereof

    公开(公告)号:US11618191B2

    公开(公告)日:2023-04-04

    申请号:US17168382

    申请日:2021-02-05

    申请人: CompoSecure, LLC

    发明人: Adam Lowe John Esau

    摘要: A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.

    DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF

    公开(公告)号:US20210154898A1

    公开(公告)日:2021-05-27

    申请号:US17168382

    申请日:2021-02-05

    申请人: CompoSecure, LLC

    发明人: Adam Lowe John Esau

    摘要: A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.