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公开(公告)号：US09870856B2
公开(公告)日：2018-01-16
申请号：US14146989
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F27/02 , H01F27/06 , H01F17/06 , H01F27/29 , H01F5/00 , H01F17/04 , H01F27/28 , H01F3/10 , H01F3/14 , H01F27/255 , H01F27/30
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
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2.发明申请MAGNETICALLY GAPPED COMPONENT ASSEMBLY INCLUDING EXPANDABLE MAGNETIC MATERIAL AND METHODS OF MANUFACTURE 审中-公开磁性元件组件包括可扩展磁性材料及其制造方法公开(公告)号：US20150170820A1
公开(公告)日：2015-06-18
申请号：US14551426
申请日：2014-11-24
Applicant: COOPER TECHNOLOGIES COMPANY
Inventor： Abdul Kadir , Ahila Krishnamoorthy
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048 , Y10T29/49073
Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with an expandable magnetic material to eliminate minute non-magnetic gaps and enhance magnetic performance. The magnetic component assemblies may define power inductors.
Abstract translation: 用于电路板的磁性部件组件包括形成有物理间隙的单个形状的磁芯片，并且经由间隙组装到芯上的导电绕组。 芯中的物理间隙填充有可膨胀磁性材料，以消除微小的非磁隙并增强磁性能。 磁性部件组件可以限定功率电感器。
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公开(公告)号：US20140266539A1
公开(公告)日：2014-09-18
申请号：US14146989
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F27/29
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
Abstract translation: 用于电路板的磁性部件组件包括形成有物理间隙的单个形状的磁芯片，并且经由间隙组装到芯上的导电绕组。 芯中的物理间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。
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公开(公告)号：US20140266555A1
公开(公告)日：2014-09-18
申请号：US14146973
申请日：2014-01-03
Applicant: Cooper Technologies Company
Inventor： Ahila Krishnamoorthy , Robert James Bogert , Yipeng Yan
IPC: H01F3/10
CPC classification number: H01F27/292 , H01F3/10 , H01F3/14 , H01F17/04 , H01F27/255 , H01F27/2847 , H01F27/306 , H01F2003/106 , H01F2017/048
Abstract: Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
Abstract translation: 用于电路板的磁性部件组件包括形成有间隙的磁芯和预先形成的导电绕组，其通过间隙组装到芯上。 芯中的间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。
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