POWER INDUCTOR ENCAPSULATED THROUGH INJECTION MOLDING

    公开(公告)号:US20180001523A1

    公开(公告)日:2018-01-04

    申请号:US15706696

    申请日:2017-09-16

    发明人: Zhi HUANG

    IPC分类号: B29C45/00 H02J50/10

    摘要: The present invention discloses a power inductor encapsulated through injection molding. The power inductor comprises a coil winding, a soft magnetic ferrite middle column inserted in a middle of the coil winding, and a magnetic powder glue for encapsulating the coil winding and the soft magnetic ferrite middle column through injection molding. The power inductor is square and meets L≧W and 2rc>0.4×2W, wherein a section width of the soft magnetic ferrite middle column perpendicular to a height direction of the inductor is 2rc, a length of the power inductor is 2L, and a width of the power inductor is 2W. According to the present invention, a balanced direct-current resistance and a direct-current superposition saturation characteristic can be obtained, and the direct-current resistance is greatly decreased while an excellent direct-current superposition saturation characteristic is ensured.