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Patent Agency Ranking
公开(公告)号：US20240182348A1
公开(公告)日：2024-06-06
申请号：US18285279
申请日：2022-03-31
Applicant: Corning Incorporated
Inventor： Euisoo Kim , Bokyung Kong , JooYoung Lee , Kwangje Woo
Abstract: A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, the heated region being heated by the heater, and the contact region being configured to be in contact with the glass panel. The cross-sectional area of the contact region is smaller than the cross-sectional area of the contact region. A heat chamfering method includes peeling an edge of a glass panel by applying thermal shock to the edge of the glass panel by moving a heated body heated by a heater relatively with respect to the glass panel along and in contact with the edge of the glass panel.
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公开(公告)号：US20240190753A1
公开(公告)日：2024-06-13
申请号：US18285293
申请日：2021-03-31
Applicant: Corning Incorporated
Inventor： Bokyung Kong , JooYoung Lee , Byoung Hoon Moon , Kwangje Woo
Abstract: A heat chamfering apparatus. A support unit supports a glass panel. A heat chamfering unit heat-chamfers an edge of the glass panel by applying thermal shock thereto. The support unit includes a contact support portion supporting the glass panel while in contact with the glass panel and a base portion configured to support the contact support portion. The contact support portion is formed from a first material. The base portion is formed from a second material. The first material has a smaller change in temperature due to lower thermal conductivity and a smaller change in size at high temperature due to a smaller coefficient of thermal expansion while being more ductile due to lower hardness, compared to the second material. In a heat chamfering method, a glass panel is located on a support unit, and an edge of the glass panel is heat-chamfered by applying thermal shock thereto.
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公开(公告)号：US20240375990A1
公开(公告)日：2024-11-14
申请号：US18286173
申请日：2022-04-08
Applicant: Corning Incorporated
Inventor： Bokyung Kong , JooYoung Lee , Byoung Hoon Moon , Kwangje Woo
Abstract: A heat chamfering method for a glass panel includes bringing a heater into contact with an edge of a glass panel by causing the heater to approach a chamfering start point. heat-chamfering the edge by moving the heater from the chamfering start point to a chamfering end point along a chamfering line. and bringing the heater into non-contact with the glass panel by causing the heater to depart from the chamfering end point. The heat-chamfering may include maintaining contact pressure between the heater moving along the chamfering line and the glass panel within a predetermined range of change. In the approaching. an angle defined by a chamfering start point approach line and the chamfering line at the chamfering start point ranges from 155° to 175°. In the departure, an angle defined by the chamfering line and a chamfering end point departure line ranges from 155° to 175°.
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公开(公告)号：US20250026963A1
公开(公告)日：2025-01-23
申请号：US18714880
申请日：2022-12-02
Applicant: CORNING INCORPORATED
Inventor： Bokyung Kong , JooYoung Lee , Joohye Oh , Yujin Shin , Kwangje Woo
IPC: C09J5/02
Abstract: A temporary sheet bonding method includes dip-coating temporary bonding layer 200 on a first sheet 100 by dipping the first sheet into a bonding solution comprising a surfactant and temporarily bonding the second sheet 300 to the first sheet via the temporary bonding layer. The surfactant includes cetyltrimethylammonium bromide or poly [(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)]. A sheet dip coating apparatus includes a bonding solution bath 410 in which a bonding solution containing a surfactant is contained, a cassette 430 into which a plurality of first sheets are to be loaded, and a driver configured to move the cassette up/down. The driver sequentially moves the cassette down to immerse the first sheet in the bonding solution, the cassette up until the plurality of first sheets are removed from the bonding solution, and the cassette up and away from a surface of the bonding solution.
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公开(公告)号：US20240182349A1
公开(公告)日：2024-06-06
申请号：US18285448
申请日：2022-04-08
Applicant: Corning Incorporated
Inventor： Euisoo Kim , Bokyung Kong , JooYoung Lee , Byoung Hoon Moon , Kwangje Woo , Choon-bong Yang
IPC: C03B33/09 , B28D1/22 , C03B23/00 , C03B33/033
CPC classification number: C03B33/09 , B28D1/221 , B28D1/225 , C03B23/002 , C03B33/033
Abstract: A method of fabricating a glass panel includes forming a non-chamfered glass panel by cutting a glass sheet. The non-chamfered glass panel is formed by cutting the glass sheet along a first sideline segment, cutting the glass sheet along a corner line segment set connected to the first sideline segment, and cutting the glass sheet along a second sideline segment connected to the corner line segment set. An extension of the first sideline segment and an extension of the second sideline segment intersect each other at a first interior angle narrower than 230°. The first sideline segment and the corner line segment set are connected at an interior angle wider than the first interior angle and 180° but narrower than 230°. The corner line segment set and the second sideline segment are connected at an interior angle wider than the first interior angle and 180° but narrower than 230°.
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