公开(公告)号：US20230192537A1

公开(公告)日：2023-06-22

申请号：US17922501

申请日：2021-05-28

Applicant: Corning Incorporated

Inventor： Stephanie Marie DeWert ,  John Albert Gephart ,  Matthew Stuart Kempton ,  Christina Marie Laskowski ,  David Andrew Pastel ,  Brandon Thomas Sternquist ,  Haregewine Tadesse

IPC: C03C17/00 ,  C03C17/32 ,  H10K59/12

CPC classification number: C03C17/002 ,  C03C17/326 ,  H10K59/12 ,  C03C2217/78 ,  C03C2218/114

Abstract: A substrate with coated edge surfaces, an apparatus for performing the coating, and a method therefor are described. The substrate may include edge surface electrical connectors, wherein the edge coating is coated overtop the edge surface electrical connectors. The apparatus for performing the coating operation includes a rotary fixture configured to facilitate coating of all edge surfaces of a stack of substrate prior to curing of the edge surface coating, wherein according to the method, edge surfaces of one group of corresponding edge surfaces in the stack are coated with a coating material, the rotary fixture is then rotated to position a second group of edge surfaces for coating, and so forth. The coating process is controlled to obtain a consistent overflow onto major surfaces of the stacked substrates.