公开(公告)号：US20050130495A1

公开(公告)日：2005-06-16

申请号：US11030003

申请日：2005-01-05

申请人： Craig Schultz ,  Todd Petit ,  Joshua Oen

发明人： Craig Schultz ,  Todd Petit ,  Joshua Oen

IPC分类号： H01L23/552 ,  H05K9/00 ,  H01R13/648

CPC分类号： H01L23/552 ,  H01L2924/0002 ,  H05K9/0007 ,  H01L2924/00

摘要： An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.

摘要翻译： 集成电路封装包括印刷电路板，非金属连接器和金属外壳。 印刷电路板包括围绕非金属连接器的接地环。 金属外壳基本上包围印刷电路板，并且具有允许接近非金属连接器的开口。 金属外壳具有与印刷电路板的接地环物理和电接触的金属唇缘。 金属外壳可用于帮助减少发射机的EMI。