公开(公告)号：US11602766B2

公开(公告)日：2023-03-14

申请号：US17348682

申请日：2021-06-15

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji Sato ,  Hitoshi Sakamoto

IPC: B05D1/00 ,  B05D1/18 ,  H01G13/00 ,  H01C17/28 ,  H05K1/18 ,  B05C3/09 ,  B05C13/02 ,  H01G2/06 ,  H01G4/005

Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

公开(公告)号：US11052422B2

公开(公告)日：2021-07-06

申请号：US16503288

申请日：2019-07-03

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji Sato ,  Hitoshi Sakamoto

IPC: B05D1/00 ,  B05D1/18 ,  H01G13/00 ,  H01C17/28 ,  H05K1/18 ,  B05C3/09 ,  B05C13/02 ,  H01G2/06 ,  H01G4/005

Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

公开(公告)号：US11345994B2

公开(公告)日：2022-05-31

申请号：US17159526

申请日：2021-01-27

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji Sato ,  Hitoshi Sakamoto

IPC: C23C16/44 ,  C23C16/455

Abstract: A method for forming a coating film on a powder includes: a dispersion step of setting a container having contained the powder P in a main body of a dispersion device, and dispersing the powder in the container by the main body of the dispersion device; and an ALD step for forming the coating film on a surface of the powder, by setting the container having been removed from the main body of the dispersion device in a main body of an ALD apparatus in such a state that gas can be introduced and be exhausted, introducing a gas for performing an ALD cycle into the container, filling the container with the gas, and then exhausting the gas.

公开(公告)号：US11338317B2

公开(公告)日：2022-05-24

申请号：US16738374

申请日：2020-01-09

Applicant: Creative Coatings Co., Ltd.

Inventor： Eiji Sato ,  Hitoshi Sakamoto

IPC: B05D1/18 ,  B05C13/02 ,  H01C17/28 ,  H01G13/00 ,  H01G2/06 ,  H01G4/005 ,  H05K1/18 ,  B05C3/09

Abstract: An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).