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公开(公告)号：US20230238190A1
公开(公告)日：2023-07-27
申请号：US18129855
申请日：2023-04-01
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
CPC classification number: H01G13/006 , B05C3/09 , B05C13/025 , H01G4/228
Abstract: A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1
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公开(公告)号：US20220282368A1
公开(公告)日：2022-09-08
申请号：US17688786
申请日：2022-03-07
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
IPC: C23C16/448 , C23C16/44 , C23C16/455
Abstract: A method for forming a barium titanate film by conducting an ALD cycle, wherein the ALD cycle comprises forming a titanium oxide film and forming barium oxide film. In the forming of a titanium oxide film, TDMAT (Ti[N(CH3)2]4) is used as first raw material gas, and an OH radical is used as reaction gas, and in the forming of barium oxide film, a vaporized barium complex is used as second raw material gas, and an OH radical is used as reaction gas, and the titanium oxide film and the barium oxide film are alternately formed in a normal order or a reverse order.
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公开(公告)号：US20220259732A1
公开(公告)日：2022-08-18
申请号：US17735897
申请日：2022-05-03
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
IPC: C23C16/455 , H01J37/32 , C23C16/52
Abstract: A film formation method for forming a CVD film and an ALD film on a film formation target. In an ALD process, an ALD cycle is repeatedly executed a plurality of times, the ALD cycle including: a first step for filling a reaction container with a source gas introduced through a first supply pipe; a second step for exhausting the source gas from the reaction container; a third step for filling the reaction container with a reactant gas activated by an inductively coupled plasma in a second supply pipe and introduced through the second supply pipe; and a fourth step for exhausting the reactant gas from the reaction container. In a CVD process, the ALD cycle is executed at least once, and the second step is finished while leaving the source gas in a gas phase in the reaction container.
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公开(公告)号：US20210308717A1
公开(公告)日：2021-10-07
申请号：US17348682
申请日：2021-06-15
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).
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公开(公告)号：US11602766B2
公开(公告)日：2023-03-14
申请号：US17348682
申请日：2021-06-15
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji Sato , Hitoshi Sakamoto
IPC: B05D1/00 , B05D1/18 , H01G13/00 , H01C17/28 , H05K1/18 , B05C3/09 , B05C13/02 , H01G2/06 , H01G4/005
Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).
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Patent Agency Ranking
公开(公告)号：US20210339963A1
公开(公告)日：2021-11-04
申请号：US17372073
申请日：2021-07-09
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
Abstract: A paste coating apparatus includes a first feeder that feeds a first belt, a mounter that joins one end portion of each of a plurality of electronic components to the first belt, a first coater that coats paste on the other end portion of each of the plurality of electronic components mounted on the first belt, a first dryer that dries the paste, a second feeder that feeds a second belt, a transfer device that transfers the plurality of electronic components from the first belt to the second belt, a second coater that coats the paste on the one end portion of each of the plurality of electronic components mounted on the second belt, a second dryer that dries the paste, and a collection device that winds and collects the second belt.
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公开(公告)号：US11052422B2
公开(公告)日：2021-07-06
申请号：US16503288
申请日：2019-07-03
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji Sato , Hitoshi Sakamoto
IPC: B05D1/00 , B05D1/18 , H01G13/00 , H01C17/28 , H05K1/18 , B05C3/09 , B05C13/02 , H01G2/06 , H01G4/005
Abstract: An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).
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公开(公告)号：US20230405548A1
公开(公告)日：2023-12-21
申请号：US18241824
申请日：2023-09-01
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
CPC classification number: B01J20/183 , B01J20/28016 , B01J20/28054 , B01J20/3204 , B01J20/3217 , B01J20/3238 , B01J20/3293 , B01D53/04 , B01J2220/4812 , B01D2253/108 , B01D2253/25
Abstract: A method for forming a zeolite membrane by performing an ALD cycle, the ALD cycle including a silicon oxide film forming step and an aluminum oxide film forming step. In the silicon oxide film forming step, an organic Si compound is used as a first raw material gas and OH radicals are used as a reaction gas; in the aluminum oxide film forming step, an organic Al compound is used as a second raw material gas and OH radicals are used as a reaction gas; and the silicon oxide films and the aluminum oxide films are alternately formed in forward or reverse order to form the zeolite membrane.
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公开(公告)号：US20230183865A1
公开(公告)日：2023-06-15
申请号：US18109178
申请日：2023-02-13
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
IPC: C23C16/455 , C23C16/40 , C23C16/18
CPC classification number: C23C16/45553 , C23C16/45536 , C23C16/408 , C23C16/18
Abstract: An ALD device includes a first precursor generator that is connected to a processing gas source and generates a first precursor to be supplied to a reactor vessel, and a second precursor generator that is connected to a reducing gas source and the reactor vessel and generates a second precursor to be supplied to the reactor vessel. The first precursor generator etches a target by a first plasma excited by a first plasma generator and supplies a compound gas containing a metallic component as the first precursor. The second precursor generator supplies radicals of a reducing gas component in a second plasma excited by a second plasma generator as the second precursor.
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公开(公告)号：US20220415578A1
公开(公告)日：2022-12-29
申请号：US17903936
申请日：2022-09-06
Applicant: Creative Coatings Co., Ltd.
Inventor： Eiji SATO , Hitoshi SAKAMOTO
IPC: H01G4/252
Abstract: An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.
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