公开(公告)号：US20190051617A1

公开(公告)日：2019-02-14

申请号：US15673734

申请日：2017-08-10

Applicant: Cree, Inc.

Inventor： David Seebacher ,  Christian Schuberth ,  Peter Singerl ,  Alexander Komposch

IPC: H01L23/00 ,  H01L23/373 ,  H01L21/48

Abstract: In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material.

公开(公告)号：US11430744B2

公开(公告)日：2022-08-30

申请号：US15673734

申请日：2017-08-10

Applicant: Cree, Inc.

Inventor： David Seebacher ,  Christian Schuberth ,  Peter Singerl ,  Alexander Komposch

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/00 ,  H01L23/42 ,  H01L23/367

Abstract: In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material.