公开(公告)号：US20130294092A1

公开(公告)日：2013-11-07

申请号：US13939827

申请日：2013-07-11

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye ,  Charles M. Swoboda ,  Antony Paul van de Ven ,  Paul Kenneth Pickard ,  Bart P. Reier ,  James Michael Lay ,  Peter E. Lopez ,  Ed Adams

IPC: F21V29/00

CPC classification number: F21V29/77 ,  F21K9/232 ,  F21K9/238 ,  F21V19/003 ,  F21V23/004 ,  F21V23/006 ,  F21V23/06 ,  F21V29/004 ,  F21V29/773 ,  F21Y2101/02 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/05 ,  H05K1/181 ,  H05K2201/10106 ,  Y02B20/30

Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.

Abstract translation: 灯具有光学透射外壳和限定灯的纵向轴线的基座，从基座延伸到外壳的自由端。 散热器至少部分地位于外壳中并且包括沿着灯的纵向轴线延伸的塔架。 LED组件位于光学透射外壳中。 LED组件包括引线框架电路或柔性电路，其中LED连接到电路。 引线框架和柔性电路形成三维形状并且热耦合到塔架。

公开(公告)号：US20130301252A1

公开(公告)日：2013-11-14

申请号：US13939821

申请日：2013-07-11

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye ,  Charles M. Swoboda ,  Antony Paul van de Ven ,  Paul Kenneth Pickard ,  Bart P. Reier ,  James Michael Lay ,  Peter E. Lopez ,  Ed Adams

IPC: F21V29/00

CPC classification number: F21V29/502 ,  F21K9/232 ,  F21V29/60 ,  F21V29/65 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.

Abstract translation: 在一个实施例中，灯包括光学透射外壳。 LED阵列设置在透光外壳中，可操作以在通过电连接通电时发光。 外壳中装有气体，以提供与LED阵列的热耦合。 电路板支持灯泡的灯具，位于外壳中。 LED阵列安装在板上，LED安装在形成三维形状的底座上。 电路板电耦合到LED阵列，并且底座可以热耦合到气体以从多个LED散热。

公开(公告)号：US09310065B2

公开(公告)日：2016-04-12

申请号：US13939821

申请日：2013-07-11

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye ,  Charles M. Swoboda ,  Antony Paul van de Ven ,  Paul Kenneth Pickard ,  Bart P. Reier ,  James Michael Lay ,  Peter E. Lopez ,  Ed Adams

IPC: F21V29/00 ,  F21K99/00 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21V29/502 ,  F21K9/232 ,  F21V29/60 ,  F21V29/65 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs.

Abstract translation: 在一个实施例中，灯包括光学透射外壳。 LED阵列设置在透光外壳中，可操作以在通过电连接通电时发光。 外壳中装有气体，以提供与LED阵列的热耦合。 电路板支持灯泡的灯具，位于外壳中。 LED阵列安装在板上，LED安装在形成三维形状的底座上。 电路板电耦合到LED阵列，并且底座可以热耦合到气体以从多个LED散热。

公开(公告)号：US09395074B2

公开(公告)日：2016-07-19

申请号：US13939827

申请日：2013-07-11

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye ,  Charles M. Swoboda ,  Antony Paul van de Ven ,  Paul Kenneth Pickard ,  Bart P. Reier ,  James Michael Lay ,  Peter E. Lopez ,  Ed Adams

IPC: F21V29/00 ,  F21K99/00 ,  F21V23/06 ,  H05K1/02 ,  F21V19/00 ,  F21Y101/02 ,  F21Y111/00 ,  H05K1/05 ,  H05K1/18 ,  F21V29/77

CPC classification number: F21V29/77 ,  F21K9/232 ,  F21K9/238 ,  F21V19/003 ,  F21V23/004 ,  F21V23/006 ,  F21V23/06 ,  F21V29/004 ,  F21V29/773 ,  F21Y2101/02 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/05 ,  H05K1/181 ,  H05K2201/10106 ,  Y02B20/30

Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.

Abstract translation: 灯具有光学透射外壳和限定灯的纵向轴线的基座，从基座延伸到外壳的自由端。 散热器至少部分地位于外壳中并且包括沿着灯的纵向轴线延伸的塔架。 LED组件位于光学透射外壳中。 LED组件包括引线框架电路或柔性电路，其中LED连接到电路。 引线框架和柔性电路形成三维形状并且热耦合到塔架。