公开(公告)号：US20220254762A1

公开(公告)日：2022-08-11

申请号：US17168251

申请日：2021-02-05

Applicant: Cree, Inc.

Inventor： Michael E. Watts ,  James Krehbiel ,  Mario Bokatius

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01L23/66

Abstract: A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.