公开(公告)号：US11228287B2

公开(公告)日：2022-01-18

申请号：US16903771

申请日：2020-06-17

Applicant: Cree, Inc.

Inventor： Madhu Chidurala ,  Marvin Marbell ,  Niklas Thulin

IPC: H03F3/191 ,  H03F1/56 ,  H03F1/02 ,  H03F3/24 ,  H03F3/195

Abstract: An electronic package houses one or more RF amplifier circuits. At least one of an input or output impedance matching network integrated on the package and electrically coupled to the gate or drain bias voltage connection, respectively, of an amplifier circuit, includes a multi-stage decoupling network. Each multi-stage decoupling network includes two or more decoupling stages. Each decoupling stage of the multi-stage decoupling network includes a resistance, inductance, and capacitance, and is configured to reduce impedance seen by the amplifier circuit at a different frequency below an operating band of the amplifier circuit. Bias voltage connections to the impedance matching circuits may be shared, and may be connected anywhere along the multi-stage decoupling network.

公开(公告)号：US20210399692A1

公开(公告)日：2021-12-23

申请号：US16903771

申请日：2020-06-17

Applicant: Cree, Inc.

Inventor： Madhu Chidurala ,  Marvin Marbell ,  Niklas Thulin

IPC: H03F1/56 ,  H03F1/02 ,  H03F3/195 ,  H03F3/24

Abstract: An electronic package houses one or more RF amplifier circuits. At least one of an input or output impedance matching network integrated on the package and electrically coupled to the gate or drain bias voltage connection, respectively, of an amplifier circuit, includes a multi-stage decoupling network. Each multi-stage decoupling network includes two or more decoupling stages. Each decoupling stage of the multi-stage decoupling network includes a resistance, inductance, and capacitance, and is configured to reduce impedance seen by the amplifier circuit at a different frequency below an operating band of the amplifier circuit. Bias voltage connections to the impedance matching circuits may be shared, and may be connected anywhere along the multi-stage decoupling network.