公开(公告)号：US10268789B1

公开(公告)日：2019-04-23

申请号：US15723286

申请日：2017-10-03

Applicant: Cree, Inc.

Inventor： Mitch Flowers ,  Ulf Andre ,  Khaled Fayed ,  Simon Wood

IPC: H01L29/66 ,  G06F17/50 ,  H01L27/088 ,  H01L23/66 ,  H01L23/00 ,  H01L29/778 ,  H03F3/213 ,  H03F3/195 ,  H03F1/56 ,  H01L27/02

Abstract: A packaged transistor amplifier includes a package having an input lead and an output lead; a transistor stage having a plurality of unit cell transistors that are electrically coupled to the input lead in parallel, each of the unit cell transistors having an output; a first output bond pad that is coupled to a first subset of the outputs of the unit cell transistors by a first feed network; a second output bond pad that is separate from the first output bond pad, the second output bond pad coupled to a second subset of the outputs of the unit cell transistors by a second feed network; a first output bond wire coupled between the first output bond pad and the output lead; and a second output bond wire coupled between the second output bond pad and the output lead. Related design methods are also provided.

公开(公告)号：US20190102498A1

公开(公告)日：2019-04-04

申请号：US15723286

申请日：2017-10-03

Applicant: Cree, Inc.

Inventor： Mitch Flowers ,  Ulf Andre ,  Khaled Fayed ,  Simon Wood

IPC: G06F17/50 ,  H01L27/02 ,  H01L27/088 ,  H01L23/66 ,  H01L23/00 ,  H01L29/778 ,  H03F3/213 ,  H03F3/195 ,  H03F1/56

Abstract: A packaged transistor amplifier includes a package having an input lead and an output lead; a transistor stage having a plurality of unit cell transistors that are electrically coupled to the input lead in parallel, each of the unit cell transistors having an output; a first output bond pad that is coupled to a first subset of the outputs of the unit cell transistors by a first feed network; a second output bond pad that is separate from the first output bond pad, the second output bond pad coupled to a second subset of the outputs of the unit cell transistors by a second feed network; a first output bond wire coupled between the first output bond pad and the output lead; and a second output bond wire coupled between the second output bond pad and the output lead. Related design methods are also provided.