公开(公告)号：US20220201838A1

公开(公告)日：2022-06-23

申请号：US17595006

申请日：2020-04-21

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/18 ,  H01Q1/38

Abstract: A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W1) of the first-direction wiring line (21) in the second region (27).

公开(公告)号：US20200373653A1

公开(公告)日：2020-11-26

申请号：US16768254

申请日：2018-11-29

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H01Q1/36 ,  H05K1/02 ,  H05K3/10 ,  H05K3/18

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

公开(公告)号：US20240421471A1

公开(公告)日：2024-12-19

申请号：US18814818

申请日：2024-08-26

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H01Q1/36 ,  H05K1/02 ,  H05K3/10 ,  H05K3/18

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

公开(公告)号：US20220037777A1

公开(公告)日：2022-02-03

申请号：US17280279

申请日：2019-09-19

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H01Q1/38 ,  H05K1/02 ,  H05K3/10

Abstract: A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 Ω/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.

公开(公告)号：US20230369751A1

公开(公告)日：2023-11-16

申请号：US18200712

申请日：2023-05-23

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Koichi SUZUKI ,  Seiji TAKE ,  Daisuke MATSUURA

IPC: H01Q1/36 ,  H05K1/02 ,  H05K3/10 ,  H05K3/18

CPC classification number: H01Q1/36 ,  H05K1/0274 ,  H05K3/108 ,  H05K3/18 ,  H05K2201/10098 ,  H05K2203/0723

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.