公开(公告)号：US11430730B2

公开(公告)日：2022-08-30

申请号：US17121222

申请日：2020-12-14

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Yuki Aritsuka ,  Takamasa Takano ,  Masaya Tanaka ,  Yumi Yoshii ,  Miyuki Suzuki ,  Shuji Sagara

IPC: H01L23/522 ,  H01L49/02 ,  H01L21/3105

Abstract: A wiring substrate of the present disclosure includes a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The substrate has an insulating surface. The first conductive layer is disposed on the substrate and includes a first part and a second part. The first part has a first thickness. The second part has a second thickness thinner than the first thickness and is adjacent to the first part. The first insulating layer is disposed on the first part and apart from the second part. The first insulating layer is disposed between the second conducting layer and the first part.