公开(公告)号：US20210134622A1

公开(公告)日：2021-05-06

申请号：US16612187

申请日：2018-04-18

Applicant: DAICEL CORPORATION

Inventor： Yoshinori FUNAKI ,  Naoko TSUJI

IPC: H01L21/67 ,  H01L21/683 ,  B32B37/12 ,  B32B9/00 ,  B32B7/12

Abstract: Provide are: a method for producing a laminate having an adhesive layer on one surface of a semiconductor wafer, with the adhesive layer being less likely to foam during wafer bonding under reduced pressure, curing of an adhesive being less likely to occur, and also allowing a tact time to be shortened; and an adhesive layer forming device to be used in the method. The adhesive layer forming device for forming an adhesive layer by removing a solvent in a coating film coated and formed on one surface of a semiconductor wafer includes: a lower plate on which the semiconductor wafer is placed; an upper cover configured to form a closed space together with the lower plate, the closed space having a volume of 10 liters or less; and pressure reducing means for reducing pressure in the closed space.