HIGH ASPECT RATIO IN-PLANE METAL MICRONEEDLE ARRAY, MANUFACTURING METHOD AND CLAMPING AND INSERTING AUXILIARY DEVICE THEREOF

    公开(公告)号:US20210046298A1

    公开(公告)日:2021-02-18

    申请号:US16960177

    申请日:2019-05-13

    Abstract: A high aspect ratio in-plane metal microneedle array, a manufacturing method and a clamping and inserting auxiliary device thereof is disclosed. A large-size metal sheet is cut into small metal sheets. A clamping tooling composed of two upper and lower metal cover plates is processed. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves in which the metal sheets are placed and fastened by bolts. Wire cutting is conducted on the tooling and the metal sheets as a whole to obtain a plane metal microneedle array with a plurality of microneedle bodies. In addition, an assembling and clamping device and an inserting auxiliary device of the high aspect ratio in-plane metal microneedle array is provided. The assembled inserting auxiliary device is placed on skin, and the microneedle array is inserted into the skin through the auxiliary device.

    IN-PLANE METAL MICRONEEDLE ARRAY AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20210138215A1

    公开(公告)日:2021-05-13

    申请号:US16960169

    申请日:2019-05-13

    Abstract: An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.

    BORON-BASED AMORPHOUS ALLOYS AND PREPARATION METHOD THEREOF

    公开(公告)号:US20210254198A1

    公开(公告)日:2021-08-19

    申请号:US17053293

    申请日:2020-05-19

    Abstract: Boron-based amorphous alloys and a preparation method thereof is provided. The composition formula of the alloys is BaCobREcX1dX2eX3f, wherein RE is any one or more of La, Ce, Pr, Nd, Sm, Gd, Dy, Er and Y; X1 is any one or more of C, Si and Al; X2 is any one or two of Fe and Ni; X3 is any one or more of Zr, Nb, Mo, Hf, Ta and W; and a, b, c, d, e and f respectively represent atomic percent of each corresponding element in the formula, where: 45≤a≤55, 25≤b≤40, 10≤c≤20, 0≤d≤10, 45≤a+d≤55, 0≤e≤20, 25≤b+e≤40, 0≤f≤3, 10≤c+f≤20 and a+b+c+d+e+f=100. The preparation method of the boron-based amorphous alloy comprises: preparing master alloy ingots using an arc furnace or an induction melting furnace; and then obtaining amorphous ribbons with different thicknesses by a single copper roller melt-spinning equipment.

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