公开(公告)号：US20120273594A1

公开(公告)日：2012-11-01

申请号：US13097566

申请日：2011-04-29

申请人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

发明人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

IPC分类号： A62C31/02 ,  B23P17/00

CPC分类号： B41J2/1621 ,  B41J2/1603 ,  B41J2/1632 ,  B41J2/1634 ,  H01L21/265 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49401

摘要： Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each slot of the at least one slot with a protective material. Additionally, the method includes grinding the substrate from a bottom portion thereof. Moreover, the method includes removing the protective material from the each slot. Further, the method includes depositing a layer of a polymeric bonding material on a bottom surface of the substrate. Furthermore, the method includes attaching a manifold chip to the layer of the polymeric bonding material. The method also includes laminating a flow feature layer and a nozzle plate over the substrate. Further disclosed are an ejection chip and a method for fabricating the ejection chip.

摘要翻译： 公开了一种用于制造流体喷射装置的方法，该方法包括在基底上形成驱动电路层，并在衬底上制造至少一个流体喷射元件。 此外，该方法包括在衬底的顶部部分内形成至少一个槽，并用保护材料填充至少一个槽的每个槽。 此外，该方法包括从其底部研磨衬底。 此外，该方法包括从每个槽中去除保护材料。 此外，该方法包括在基底的底表面上沉积聚合物粘结材料层。 此外，该方法包括将歧管芯片附接到聚合物粘合材料的层。 该方法还包括在基底上层叠流动特征层和喷嘴板。 另外公开了一种喷射芯片及其制造方法。

公开(公告)号：US20120273597A1

公开(公告)日：2012-11-01

申请号：US13097549

申请日：2011-04-29

申请人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

发明人： DAVID BERNARD ,  ANDREW MCNEES ,  JAMES MRVOS

IPC分类号： B05B1/14 ,  B23P17/00

CPC分类号： B41J2/1433 ,  B41J2/04541 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  B41J2/1645 ,  B41J2202/03 ,  B41J2202/12 ,  B41J2202/13 ,  B41J2202/19 ,  B41J2202/22 ,  H01L21/265 ,  Y10T29/49083 ,  Y10T29/49401

摘要： Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method.

摘要翻译： 公开了一种制造流体喷射装置的方法。 该方法包括在衬底上形成驱动电路层。 该方法还包括在衬底上制造至少一个流体喷射元件。 此外，该方法包括在衬底的顶部部分内形成至少一个槽，并在衬底的底部部分内形成至少一个流体供给槽。 至少一个流体供给沟槽的每个流体供给沟槽与至少一个槽的一个或多个槽流体连通。 此外，该方法包括将流动特征层和喷嘴板层压在具有至少一个槽和在其中形成的至少一个流体进料沟槽的基底上。 另外公开了使用上述方法制造的流体喷射装置。