公开(公告)号：US11732167B2

公开(公告)日：2023-08-22

申请号：US17454106

申请日：2021-11-09

申请人： DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

发明人： Huide D. Zhu ,  Daniel P. Sophiea ,  Andrew R. Kneisel ,  Matthew B. Feldpausch ,  Susan P. Sevidal

IPC分类号： C09J175/04 ,  C09J11/04 ,  C09J11/06 ,  C08K3/04 ,  C08K5/5415

CPC分类号： C09J175/04 ,  C09J11/04 ,  C09J11/06 ,  C08K3/04 ,  C08K5/5415 ,  C09J2301/312

摘要： Moisture-curable, one component adhesives contain an isocyanate-terminated prepolymer, a low molecular weight polyisocyanate compound, a hydrolysable mercaptosilane, a urethane catalyst and a carbon black filler. The adhesives exhibit an excellent combination of high modulus, excellent hydrolytic and heat stability, and high sag resistance.

公开(公告)号：US20220073796A1

公开(公告)日：2022-03-10

申请号：US17454106

申请日：2021-11-09

申请人： DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

发明人： Huide D. Zhu ,  Daniel P. Sophiea ,  Andrew R. Kneisel ,  Matthew B. Feldpausch ,  Susan P. Sevidal

IPC分类号： C09J175/04 ,  C09J11/04 ,  C09J11/06

摘要： Moisture-curable, one component adhesives contain an isocyanate-terminated prepolymer, a low molecular weight polyisocyanate compound, a hydrolysable mercaptosilane, a urethane catalyst and a carbon black filler. The adhesives exhibit an excellent combination of high modulus, excellent hydrolytic and heat stability, and high sag resistance.