IMMERSION COOLING SYSTEM WITH AIRTIGHT LINK LATCH COVER STRUCTURE

    公开(公告)号:US20240422942A1

    公开(公告)日:2024-12-19

    申请号:US18227194

    申请日:2023-07-27

    Abstract: An immersion cooling system is provided. The immersion cooling system includes a box, an upper cover, plural fixing components, plural latches and a link module. The box has an opening upwardly. The upper cover covers the opening. The fixing components are disposed on the box and arranged adjacent to the outer perimeter of the opening. The latches corresponding to the fixing components are disposed on the upper cover. The link module includes plural crossbars corresponding to the latches. The link module moves downwardly close to the upper cover, scroll-wheels of the latches roll along limiting surfaces of corresponding fixing components and press against the upper cover, the upper cover closes the opening to form an airtight space. The link module moves upwardly away from the upper cover, the scroll-wheels are separated away from the limiting surfaces of corresponding fixing components, allows the upper cover to separate from the opening.

    Immersion cooling system
    3.
    发明授权

    公开(公告)号:US12041751B2

    公开(公告)日:2024-07-16

    申请号:US17662080

    申请日:2022-05-05

    CPC classification number: H05K7/203 H05K7/20318 H05K7/20327

    Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

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