公开(公告)号：US10064309B2

公开(公告)日：2018-08-28

申请号：US15429541

申请日：2017-02-10

Applicant: DELTA ELECTRONICS, INC.

Inventor： Lee-Lung Chen ,  Tse-Hsin Wang ,  Ying-Chi Chen ,  Wu-Chi Li

IPC: H05K7/20

CPC classification number: H05K7/202 ,  H05K7/20209 ,  H05K7/20572 ,  H05K7/206 ,  H05K7/20736 ,  H05K7/20745

Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.

公开(公告)号：US10088249B2

公开(公告)日：2018-10-02

申请号：US15168969

申请日：2016-05-31

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wu-Chi Lee ,  Tse-Hsin Wang ,  Ying-Chi Chen ,  Lee-Lung Chen

IPC: F24D5/10 ,  F28F13/06 ,  F28D9/00 ,  F28D21/00

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.