公开(公告)号：US12108562B2

公开(公告)日：2024-10-01

申请号：US17967607

申请日：2022-10-17

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Tim Hubbard

IPC: H05K7/20 ,  F28D9/00 ,  F28F3/02 ,  G02F1/1333

CPC classification number: H05K7/202 ,  G02F1/133385 ,  H05K7/20136 ,  H05K7/20163 ,  H05K7/20972 ,  F28D9/00 ,  F28F3/02

Abstract: A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and extending along opposing sides of an image assembly is provided. Ambient air is ingested into the housing through an intake, passed within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausted from the housing through an exhaust to change a temperature of the circulating gas.

公开(公告)号：US12048114B2

公开(公告)日：2024-07-23

申请号：US17718873

申请日：2022-04-12

Applicant: Hoffman Enclosures Inc.

Inventor： Michael Koehler ,  Randal Schroeder ,  Michael Woods ,  Jeff Thibedeau ,  Joseph Ricke

IPC: H05K7/20

CPC classification number: H05K7/202 ,  H05K7/20136 ,  H05K7/20309 ,  H05K7/20318

Abstract: An air conditioner for an enclosure that can include a housing that partly defines an ambient air exchange cavity and a tub that further defines the ambient air exchange cavity and partly defines a cooling cavity. The tub can support a first heat exchanger within the ambient air exchange cavity, and a second heat exchanger and a fan within the cooling cavity. The second heat exchanger can be included in a coolant flow loop with the first heat exchanger and the fan can move air across the second heat exchanger and into the inlet of the enclosure. The second heat exchanger can be located above the fan. A fluid trap can be provided below the second heat exchanger and adjacent the fan to capture condensate from the second heat exchanger and can direct the condensate into the ambient air exchange cavity for disposal.

公开(公告)号：US20240237251A9

公开(公告)日：2024-07-11

申请号：US17970340

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Jeffery Todd Sayles ,  Ty Robert Schmitt

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1431 ,  H05K7/202 ,  H05K7/20745 ,  H05K7/20836

Abstract: A modular data center includes: a modular information technology component (MITC), in which the MITC includes an information handling system (IHS) and a utility control component (UCC), in which the IHS and the UCC are affixed to a bottom side of the MITC; and a front access component and a rear access component, in which the front access component is connected to a front side of the MITC, in which an area of the front access component is equal to an area of the front side of the MITC, in which the rear access component is connected to a rear side of the MITC, and in which an area of the rear access component is equal to an area of the rear side of the MITC.

公开(公告)号：US11985793B2

公开(公告)日：2024-05-14

申请号：US17156075

申请日：2021-01-22

Applicant: DELL PRODUCTS L.P.

Inventor： Jean M. Doglio ,  Patrick V. Illingworth

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/202 ,  H05K7/1491

Abstract: Cable channel apparatus are provided that may be employed for routing system cables through open spaces defined within chassis walls, barriers or other fixed surfaces that separate different compartments or areas of an information handling system chassis. The cable channel apparatus may form a seal around the inserted system cables that prevents recirculation of cooling air through the open spaces between the different compartments. In one example, the cable channel apparatus may be employed to form such a seal around system cables that are routed through an open space to pass though or around a fan gantry that is mounted within a chassis of an information handling system chassis.

公开(公告)号：US20240090153A1

公开(公告)日：2024-03-14

申请号：US18240346

申请日：2023-08-30

Applicant: AA Power Inc.

Inventor： Qun Lu

IPC: H05K7/14 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/14322 ,  H05K1/021 ,  H05K7/202

Abstract: An apparatus includes a case, a first printed circuit board (PCB) and a second PCB within the case. The case includes a top portion and a bottom portion opposite to each other. The first PCB has a first surface and a second surface opposite to each other, and is attached to the top portion of the case via the second surface of the first PCB. At least one heat-generating device is mounted on the first surface of the first PCB. The second PCB has a first surface and a second surface opposite to each other, and is attached to the bottom portion of the case via the second surface of the second PCB. At least one heat-generating device is mounted on the first surface of the second PCB. The apparatus may include more PCBs. An inner shell may be provided forming an air duct within the case.

公开(公告)号：US20240090116A1

公开(公告)日：2024-03-14

申请号：US17975721

申请日：2022-10-28

Applicant: Ciena Corporation

Inventor： Chander Prakash Gupta ,  Sachin Singla ,  Ranjeet Chaurasiya ,  Rampratap Mahawar ,  Shubham Kumar

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0274 ,  H05K7/202 ,  H05K7/20209 ,  H05K7/2039 ,  H04B10/40

Abstract: The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

公开(公告)号：US20240034255A1

公开(公告)日：2024-02-01

申请号：US18380526

申请日：2023-10-16

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Jack Bartholmae ,  Douglas Bennett

IPC: B60R16/033 ,  H05K5/00 ,  H05K7/20 ,  B60R13/00 ,  H02J7/00 ,  H02S10/40 ,  H02S30/10 ,  H02S40/38 ,  H02J7/35 ,  B60L58/10 ,  B60K6/24 ,  B60K6/26 ,  B60K6/28 ,  B60R9/04 ,  B60R11/02 ,  G09F9/33 ,  G09F21/04 ,  H02S20/10 ,  E04H1/12 ,  H02J3/38 ,  H02S40/42 ,  B60R16/03

CPC classification number: B60R16/033 ,  H05K5/0017 ,  H05K7/20972 ,  H05K7/20172 ,  B60R13/00 ,  H02J7/0068 ,  H02S10/40 ,  H02S30/10 ,  H02S40/38 ,  H02J7/35 ,  B60L58/10 ,  B60K6/24 ,  B60K6/26 ,  B60K6/28 ,  B60R9/04 ,  B60R11/0229 ,  G09F9/33 ,  G09F21/04 ,  H05K7/202 ,  H02S20/10 ,  E04H1/1211 ,  H02J3/381 ,  H05K7/20954 ,  H02S40/425 ,  G09F21/042 ,  B60R11/0235 ,  B60R16/03 ,  B60Y2300/91 ,  B60Y2400/112 ,  B60Y2400/43 ,  B60Y2400/60 ,  G09F9/35

Abstract: A solar powered display assembly and related systems and methods are disclosed. A controller is interposed between an electronic display at a housing, an alternative power source external to, but electrically connected to the display assembly at a housing, and a solar energy harvesting device. The controller determines a power requirement for operating the display assembly, determines power available from the solar energy harvesting device, and where the power available from the solar energy harvesting device meets or exceeds the power requirement, sources operational power from the solar energy harvesting device. Where the power available from the solar energy harvesting device falls below the power requirement, the controller sources the power available from the solar energy harvesting device as a portion of the operational power, and sources supplemental power from the alternative power source.

公开(公告)号：US20240032238A1

公开(公告)日：2024-01-25

申请号：US17870913

申请日：2022-07-22

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Andrew Lincoln

IPC: H05K7/20 ,  H05K5/02 ,  G02F1/1333 ,  G02F1/13357 ,  B60L53/302 ,  B60L53/30

CPC classification number: H05K7/202 ,  H05K5/0214 ,  H05K7/20972 ,  G02F1/133385 ,  G02F1/133603 ,  H05K7/20909 ,  B60L53/302 ,  B60L53/305

Abstract: A display assembly includes a mounting structure with one or more cavities for electronic equipment located along a dedicated central airflow pathway for a first flow of ambient air. Each of a number of side assemblies are attached to a respective side of the mounting structure and include a front cover, a display layer located rearward of the front cover, an illumination device for illuminating the display layer when operated, and one or more dedicated side assembly airflow pathways.

公开(公告)号：US20230359077A1

公开(公告)日：2023-11-09

申请号：US18222001

申请日：2023-07-14

Applicant: Manufacturing Resources International, Inc.

Inventor： William Dunn ,  Marcos Diaz ,  Mike Brown ,  Kevin O’Connor ,  Alex Moreau

IPC: G02F1/1333 ,  H05K7/20

CPC classification number: G02F1/133385 ,  G02F1/133308 ,  H05K7/202 ,  H05K7/20972 ,  G02F1/133603

Abstract: Display assemblies are provided which include subassemblies attached to a structural framework, each including a passageway and at least one of which also includes an electronic display layer, an illumination device, and a forward cover. A closed loop airflow pathway for circulating gas is formed by a rear passageway behind the subassemblies and the passageway of each subassembly. Fan units associated the subassemblies and positioned to cause flow of the circulating gas within the passageways of the respective subassemblies in a respective direction.

公开(公告)号：US11785741B2

公开(公告)日：2023-10-10

申请号：US17380314

申请日：2021-07-20

Applicant: Dell Products L.P.

Inventor： Qinghong He

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  G06F1/20 ,  H05K7/202 ,  H05K7/20136

Abstract: A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.