公开(公告)号：US20200185320A1

公开(公告)日：2020-06-11

申请号：US16619414

申请日：2018-06-07

Applicant: DENKA COMPANY LIMITED

Inventor： Ryota AONO ,  Fumihiro NAKAHARA ,  Kouji NISHIMURA ,  Yuta TSUGAWA

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  C23C18/42

Abstract: A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 μm to 1.5 μm; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 μm to 1.5 μm.