CERAMIC CIRCUIT BOARD
    1.
    发明申请
    CERAMIC CIRCUIT BOARD 有权
    陶瓷电路板

    公开(公告)号:US20160358840A1

    公开(公告)日:2016-12-08

    申请号:US15119052

    申请日:2015-02-20

    Abstract: [Problem] To obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties.[Solution] A ceramic circuit substrate in which metal plates and both main surfaces of a ceramic substrate are bonded via silver-copper brazing material layers, the ceramic Cit quit substrate characterized in that the silver-copper brazing material layers are formed from a silver-copper brazing material including 0.3-7.5 parts by mass of carbon fibers and 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin with respect to 75-98 parts by mass of silver powder and 2-25 parts by mass of copper powder totaling 100 part by mass, with the carbon fibers having an average length of 15-400 μm, an average diameter of 5-25 μm and an average aspect ratio of 3-28.

    Abstract translation: [解决方案]陶瓷电镀基板,其中金属板和陶瓷基板的两个主表面通过银 - 铜钎料层接合,陶瓷Cit离子基板的特征在于,银 - 铜钎焊材料层由银 - 含有0.3〜7.5质量份的碳纤维的铜钎焊材料和选自钛,锆,铪,铌,钽,钒和锡中的至少一种活性金属相对于75-98份的1.0-9.0质量份 银粉的质量和总计100质量份的2〜25质量份的铜粉,碳纤维的平均长度为15〜400μm,平均直径为5〜25μm,平均长径比为3〜 28。

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