公开(公告)号：US20220204830A1

公开(公告)日：2022-06-30

申请号：US17441740

申请日：2020-03-25

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Takaaki TANAKA

IPC: C09K5/14 ,  C01B21/064 ,  C08K3/38

Abstract: Provided is a boron nitride powder including: an agglomerated particle obtained by aggregating flaky primary particles, in which in-plane directions of the primary particles are oriented in a direction parallel to a short-side direction of the agglomerated particle. In addition, provided is a method for producing a boron nitride powder including: a nitriding step of firing a boron carbide powder having an aspect ratio of 1.5 to 10 in a nitrogen pressurized atmosphere to obtain a fired product; and a crystallization step of heating a formulation that contains the fired product and a boron source to produce flaky boron nitride primary particles and obtaining a boron nitride powder containing an agglomerated particle obtained by aggregating the primary particles.

公开(公告)号：US20230357008A1

公开(公告)日：2023-11-09

申请号：US18246159

申请日：2021-09-27

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Hiroyuki SHIOTSUKI ,  Takaaki TANAKA

IPC: C01B21/064

CPC classification number: C01B21/0648 ,  C01P2002/76 ,  C01P2004/50 ,  C01P2004/61 ,  C01P2006/80 ,  C01P2006/12

Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a concentration of elutable impurities is 700 ppm or less.

公开(公告)号：US20220153583A1

公开(公告)日：2022-05-19

申请号：US17441263

申请日：2020-03-25

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Takaaki TANAKA

IPC: C01B21/064 ,  C08K3/38 ,  C08L63/00

Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

公开(公告)号：US20230399264A1

公开(公告)日：2023-12-14

申请号：US18246811

申请日：2021-09-27

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Hiroyuki SHIOTSUKI ,  Takaaki TANAKA

IPC: C04B35/583 ,  C04B35/626

CPC classification number: C04B35/583 ,  C04B35/62645 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/386

Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles containing carbon is 10 or less per 10 g of the boron nitride powder.

公开(公告)号：US20230357007A1

公开(公告)日：2023-11-09

申请号：US18246145

申请日：2021-09-27

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Hiroyuki SHIOTSUKI ,  Takaaki TANAKA

IPC: C01B21/064

CPC classification number: C01B21/0648 ,  C01P2004/50 ,  C01P2006/80 ,  C01P2006/42 ,  C01P2004/61 ,  C01P2006/12

Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles having a magnetizing ability is 10 or less per 10 g of the boron nitride powder.

公开(公告)号：US20220154059A1

公开(公告)日：2022-05-19

申请号：US17441266

申请日：2020-03-25

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Takaaki TANAKA

IPC: C09K5/14 ,  C01B21/064 ,  C08K3/38

Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

公开(公告)号：US20230043653A1

公开(公告)日：2023-02-09

申请号：US17780910

申请日：2020-12-03

Applicant: DENKA COMPANY LIMITED

Inventor： Atsunori KOYAMA ,  Mizuharu MATSUYOSHI ,  Satoshi HIRATA ,  Takaaki TANAKA ,  Kouji KOUNO

IPC: C04B35/622

Abstract: An inorganic fiber molded body includes an alumina fiber, an inorganic porous filler, and a colloidal silica, in which a ratio of crystalline minerals in the alumina fiber is 30% by mass or more and 80% by mass or less, the inorganic porous filler contains CaO·6Al2O3 in which a particle diameter D95, which has a cumulative value of 95% in a volume frequency particle size distribution, is 300 μm or less, and in 100% by mass of the inorganic fiber molded body, a content of the alumina fiber is 15% by mass or more and 70% by mass or less, a content of the inorganic porous filler is 20% by mass or more and 79% by mass or less, and a content of the colloidal silica is 2% by mass or more and 8% by mass or less.

公开(公告)号：US20220402759A1

公开(公告)日：2022-12-22

申请号：US17777521

申请日：2020-11-12

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Masao TSUICHIHARA ,  Takaaki TANAKA

IPC: C01B21/064

Abstract: One aspect of the present disclosure provides a hexagonal boron nitride powder having a purity of 98 mass % or more and a specific surface area of less than 2.0 m2/g.

公开(公告)号：US20220388845A1

公开(公告)日：2022-12-08

申请号：US17770475

申请日：2020-10-21

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Haruka TAKEOKA ,  Takaaki TANAKA

IPC: C01B21/064 ,  C08K3/38 ,  C09K5/14

Abstract: One aspect of the present invention provides a boron nitride powder that contains aggregated particles formed through aggregation of primary particles of boron nitride. The cumulative pore volume of the boron nitride powder within a fine pore radius of 0.02-1.2 μm as measured by a mercury porosimeter is 0.65 mL/g or less.