MULTILAYER STRUCTURE INCLUDING INSULATING LAYER

    公开(公告)号:US20250010581A1

    公开(公告)日:2025-01-09

    申请号:US18701376

    申请日:2022-10-12

    Abstract: A multilayer structure includes at least one insulating layer(s), at least one resin layer(s), and at least one copper foil(s) each having a smooth surface and a roughened surface, wherein the insulating layer contains an olefin-aromatic vinyl compound-aromatic polyene copolymer and a surface modifier, wherein the resin layer contains one or more selected from the group consisting of polyimide, liquid crystal polymer, polyphenylene ether, polyfunctional aromatic vinyl resin, epoxy resin, and the same composition as in the insulating layer, wherein at least one surface of the respective insulating layer(s) is bonded to a smooth surface of the copper foil, and wherein, for each respective resin layer: at least one surface of the resin layer is bonded to the roughened surface, and the resin layer is not bonded to the smooth surface; or both surfaces of the resin layer are not bonded to the copper foil.

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