公开(公告)号：US20230326817A1

公开(公告)日：2023-10-12

申请号：US18334625

申请日：2023-06-14

Applicant: DENSO CORPORATION

Inventor： Noboru NAGASE ,  Ippei KAWAMOTO ,  Toshihiro FUJITA ,  Atsushi SAITO ,  Hideki KABUNE

IPC: H01L23/08 ,  H01L23/14 ,  H01L23/29 ,  H01L23/495

CPC classification number: H01L23/08 ,  H01L23/14 ,  H01L23/293 ,  H01L23/49568

Abstract: A semiconductor package includes semiconductor elements, a lead frame, a crosslinked member, and sealing resin. Each of the semiconductor elements has a first surface and a second surface located on a side opposite to the first surface. The lead frame has a mounting portion and a connected portion. At least one of the semiconductor elements mounts on the mounting portion. The connected portion is separated from the mounting portion. The crosslinked member is connected to the second surface of at least one of the semiconductor elements and the connected portion to electrically connect at least one of the semiconductor elements and the connected portion. The sealing resin is electrically insulated and covers a portion of the lead frame, the semiconductor elements and the crosslinked member. At least one of the semiconductor elements is different from another one of the semiconductor elements in element size or power consumption.