公开(公告)号：US10985636B2

公开(公告)日：2021-04-20

申请号：US16395481

申请日：2019-04-26

Applicant: DENSO CORPORATION

Inventor： Masayoshi Nishihata ,  Nobumasa Ueda ,  Hiroki Kiyose

IPC: H02K11/33 ,  H02K3/50 ,  H01L23/50 ,  H01L25/07 ,  H01L23/367 ,  H01L25/18 ,  H02M7/48

Abstract: A semiconductor device includes: a plurality of control modules that controls a rotating electric machine. Each control module includes at least two sets of arms, each set including high-side and low-side switching elements that provide an inverter. A plurality of arms of each control module are coupled in parallel to each other with respect to a bus bar coupled to one power source. Each control module includes a metal plate on which the high-side and low-side switching elements are mounted, and mediates an electric coupling with the power source. Each metal plate includes a first metal plate on which one set of arms is disposed, a second metal plate on which another set of arms is disposed, and a coupling plate that couples the first and second metal plates.

公开(公告)号：US10797569B2

公开(公告)日：2020-10-06

申请号：US16394473

申请日：2019-04-25

Applicant: DENSO CORPORATION

Inventor： Masayoshi Nishihata ,  Nobumasa Ueda ,  Hiroki Kiyose

IPC: H02K11/33 ,  H01L23/367 ,  H01L23/50 ,  H01L25/07 ,  H02K3/50 ,  H02M7/48

Abstract: A semiconductor device includes: a plurality of control modules to control a rotating electric machine. The plurality of control modules are circularly arranged around a rotary shaft of the rotating electric machine. Each control module includes at least one switching element supplied with a current from a bus bar coupled to a power source. The at least one switching element in one of the control modules under a structural condition of arrangement has a lower resistance than another switching element.