公开(公告)号：US20200083183A1

公开(公告)日：2020-03-12

申请号：US16562531

申请日：2019-09-06

Applicant: DENSO CORPORATION

Inventor： Toshihiko TAKAHATA ,  Hiroo ANAN

IPC: H01L23/66 ,  H01L23/29 ,  H01L29/93 ,  G01S7/03

Abstract: An electronic component includes: a variable capacitance element; a substrate that has the variable capacitance element; a connection pattern that is electrically connected to the variable capacitance element; and a sealing member that has permittivity lower than that of the substrate and has insulation resistance higher than that of the substrate. At least a part of the connection pattern is disposed on an outer surface of the sealing member.

公开(公告)号：US20170199090A1

公开(公告)日：2017-07-13

申请号：US15314969

申请日：2015-08-21

Applicant: DENSO CORPORATION

Inventor： Hiroo ANAN ,  Takashi INOUE

IPC: G01L1/18 ,  G01L5/16

CPC classification number: G01L1/18 ,  G01L1/20 ,  G01L5/16

Abstract: A load sensor includes: a substrate; a rib on the substrate; and two vertical transistors. Each vertical transistor includes: a gate electrode, a gate insulation film, and a semiconductor thin film on the side surface of the rib; a bottom electrode layer on a bottom of the substrate, on which the rib is not arranged, with contacting the semiconductor thin film; and a top electrode layer on a top of the rib with contacting the semiconductor thin film. Each vertical transistor flows current between the bottom electrode layer and the top electrode layer when a channel region is provided in the semiconductor thin film. Each straight line along normal line directions of the channel regions in the vertical transistors is arranged on a different side surface of the rib from each other, and has a predetermined angle between the straight lines.