公开(公告)号：US20140354054A1

公开(公告)日：2014-12-04

申请号：US14281993

申请日：2014-05-20

Applicant: DENSO CORPORATION

Inventor： Hirotsugu KATOU

IPC: H02J1/00

CPC classification number: H02J7/0068 ,  B60L3/00 ,  B60L3/12 ,  B60L11/1853 ,  B60L11/1861 ,  B60L2240/547 ,  B60L2250/16 ,  H02J7/0029 ,  H02J7/0057 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y10T307/50

Abstract: A control apparatus is used for a power-supply apparatus with power-supply systems connected in parallel between a pair of power wires connected to a load. Each power-supply system has a series circuit of a battery and a contact of a relay. When the control apparatus determines that at least one relay suffers from a contact welding, the control apparatus performs a battery charge/discharge process to charge/discharge the batteries through the pair of power wires by turning ON one of possible relays while turning OFF the others of the possible relays. The possible relay is defined as having a possibility of suffering from the contact welding. After the battery charge/discharge process, the control apparatus identifies which possible relay actually suffers from the contact welding based on a change in a state of the battery connected in series with the contact of each possible relay.

Abstract translation: 控制装置用于具有与连接到负载的一对电源线并联连接的电源系统的电源装置。 每个电源系统具有电池的串联电路和继电器的触点。 当控制装置确定至少一个继电器遭受接触焊接时，控制装置执行电池充电/放电处理，以通过一对电源线对电池进行充电/放电，通过接通其中一个可能的继电器，同时关闭其他电源 的可能继电器。 可能的继电器被定义为具有接触焊接的可能性。 在电池充电/放电处理之后，控制装置基于与每个可能继电器的接触串联连接的电池的状态的变化来识别哪个可能的继电器实际受到接触焊接的影响。

公开(公告)号：US20150245471A1

公开(公告)日：2015-08-27

申请号：US14615772

申请日：2015-02-06

Applicant: DENSO CORPORATION

Inventor： Hirotsugu KATOU ,  Junji SUGIURA ,  Akito ITOU

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0286 ,  H05K2201/09781 ,  H05K2201/09972

Abstract: An electronic device includes a multilayer substrate including a plurality of layers of conductors. The multilayer substrate has a first region and a second region divided in a planar direction of the multilayer substrate. The first region is provided with a main circuit that realizes a predetermined function. The second region is provided to have an additional circuit for adding a function to the predetermined function therein. The first region includes a first wiring for electrically connecting the main circuit to the additional circuit and a connecting portion disposed at an end of the first region adjacent to the second region and extending in the multilayer substrate to correspond to all of the conductors layered to electrically connect the first wiring to any of the conductors. The main circuit is connectable with the additional circuit through the first wiring and the connecting portion.

Abstract translation: 电子设备包括包括多层导体的多层衬底。 多层基板具有在多层基板的平面方向上划分的第一区域和第二区域。 第一区域设置有实现预定功能的主电路。 第二区域设置成具有用于向其中的预定功能添加功能的附加电路。 第一区域包括用于将主电路电连接到附加电路的第一布线和设置在与第二区域相邻的第一区域的端部处并在多层基板中延伸的连接部分，以对应于分层到电的所有导体 将第一个接线连接到任何导体。 主电路可通过第一布线和连接部分与附加电路连接。