公开(公告)号：US20230098430A1

公开(公告)日：2023-03-30

申请号：US17948318

申请日：2022-09-20

Applicant: DENSO CORPORATION

Inventor： Hirotaka MIYANO ,  Masami SAITO ,  Kazuhiro MORITA ,  Taiga HANDA ,  Katsuhito MORI ,  Kunio MORI

IPC: C09J5/04

Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.